1M803 Datasheet, PDF (1/3 Pages) Anaren Microwave – Micro Xinger 3dB Hybrid Coupler

Model 1M803
Rev. E
Micro Xinger
3dB Hybrid Coupler
Description
The 1M803 Micro Xinger® is a low profile, miniature 3dB hybrid coupler in
an easy to use surface mount package designed for U-NII, ISM and hyper
LAN applications. The 1M803 is designed for balanced amplifiers and
signal distribution and is an ideal solution for the ever increasing demands
of the wireless industry for smaller printed circuit boards and high
performance. Parts have been subjected to rigorous qualification testing
and units are 100% tested. They are manufactured using materials with x
and y thermal expansion coefficients compatible with common substrates
such as FR4 and G-10. Available in both 5 of 6 tin lead (1M803) and 6 of 6
RoHS compliant tin immersion (1M803S).
Features:
• Very Low Loss
• High Isolation
• 90o Quadrature
• Surface Mountable
• Tape And Reel
• Available in Lead-Free (as
illustrated) or Tin-Lead
Mechanical Outline
ELECTRICAL SPECIFICATIONS**
Frequency
Isolation
Insertion
Loss
GHz
dB Min
dB Max
VSWR
Max:1
5.0 – 6.0
4.8 – 6.0
20
0.25
1.21
20
0.25
1.21
Amplitude
Balance
dB Max
Phase
Balance
Degrees
Power
Ave. CW
Watts
ΘJC
ºC/Watt
Operating
Temp.
ºC
± 0.30
± 0.40
±3
± 3.5
20
78.1
-55 to +85
**Specification based on performance of unit properly installed on microstrip printed circuit
boards with 50 Ω nominal impedance. Specifications subject to change without notice.
Pin 1
.400^±.010
[10.16^±0.25]
Pin 2
.200^±.010
[5.08^±0.25]
Pin 4
GND
Pin 3
Dimensions are in Inches [Millimeters]
1M803* Mechanical Outline
.064^±.013
[1.62^±0.33]
GND
4X .024^±.004
[0.61^±0.10]
.104^±.004
[2.64^±0.10]
Denotes
Array Number
.304^±.004
[7.72^±0.10]
4X .048^±.008 SQ
[1.22^±0.20]
* For RoHS Compliant Versions order with S suffix
Tolerances are Non-Cumulative
Available on Tape
and Reel For Pick and
Place Manufacturing.
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