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AM3524C Datasheet, PDF (1/3 Pages) Analog Power – N & P-Channel 20-V (D-S) MOSFET
Analog Power
AM3524C
N & P-Channel 20-V (D-S) MOSFET
These miniature surface mount MOSFETs
utilize a high cell density trench process to
provide low rDS(on) and to ensure minimal
power loss and heat dissipation. Typical
applications are DC-DC converters and
power management in portable and
battery-powered products such as
computers, printers, PCMCIA cards,
cellular and cordless telephones.
•
Low rDS(on) provides higher efficiency and
extends battery life
• Low thermal impedance copper leadframe
TSOP-6 saves board space
• Fast switching speed
• High performance trench technology
PRODUCT SUMMARY
VDS (V)
20
-20
rDS(on) (Ω)
0.047 @ VGS = 4.5V
0.055 @ VGS = 2.5V
0.079 @ VGS = -4.5V
0.110 @ VGS = -2.5V
TSOP-6
Top View
G1 1 6 D1
S2 2 5 S1
G2 3 4 D2
D1
G1
S1
N-Channel MOSFET
ID (A)
4.1
3.8
-3.2
-2.7
S2
G2
D2
P-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (TA = 25 oC UNLESS OTHERWISE NOTED)
Parame te r
Symbol N-Channel P-Channel Units
Drain-Source Voltage
Gate-Source Voltage
VDS
20
-20
V
VGS
±8
±8
Continuous Drain Currenta
TA=25oC
TA=70oC
ID
4.1
-3.2
3.3
-2.6
A
Pulsed Drain Currentb
IDM
8
-8
Continuous Source Current (Diode Conduction)a
IS
1.05
-1.05
A
Power Dissipationa
TA=25oC
TA=70oC
PD
1.15
W
0.7
Operating Junction and Storage Temperature Range TJ, Tstg
-55 to 150
oC
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction-to-Ambienta
t <= 10 sec
Steady State
Symbol
RthJA
N-Channel
Typ
Max
93
110
130
150
P-Channel
Typ
Max
93
110
130
150
Unit
oC/W
Notes
a. Surface Mounted on 1” x 1” FR4 Board.
b. Pulse width limited by maximum junction temperature
1
PRELIMINARY
Publication Order Number:
DS-AM3524_A