AAT2848 Datasheet, PDF (15/19 Pages) Advanced Analogic Technologies – High-Current Charge Pump For Backlight Display and Flash Applications

ChargePump^TM
PRODUCT DATASHEET
AAT2848
High-Current Charge Pump For Backlight Display and Flash Applications
pad acts, thermally, to transfer heat from the chip and,
electrically, as a ground connection.
The junction-to-ambient thermal resistance (θ_JA) for the
connection can be significantly reduced by following a
couple of important PCB design guidelines. The PCB area
directly underneath the package should be plated so
that the exposed paddle can be mated to the top layer
PCB copper during the reflow process. Multiple copper
plated thru-holes should be used to electrically and ther-
mally connect the top surface pad area to additional
ground plane(s).
The chip ground is internally connected to both the
exposed pad and to the AGND and PGND pins. It is good
practice to connect the GND pins to the exposed pad
area with traces.
The flying capacitors (C1 and C2), input capacitor (C4),
and output capacitor (C5) should be connected as close
as possible to the IC. In addition to the external passive
components being placed as close as possible to the IC,
all traces connecting the AAT2848 should be as short
and wide as possible to minimize path resistance and
potential coupling.
Manufacturer
AVX
TDK
Murata
Taiyo Yuden
Part Number
0603ZD105K
0603ZD225K
C1608X5R1E105K
C1608X5R1C225K
C1608X5R1A475K
GRM188R61C105K
GRM188R61A225K
LMK107BJ475KA
Value
1μF
2.2μF
1μF
2.2μF
4.7μF
1μF
2.2μF
4.7μF
Voltage
10
10
25
16
10
16
10
10
Table 3: Suggested Capacitor Components.
Temp. Co.
X5R
X5R
X5R
X5R
Case
0603
0603
0603
0603
2848.2008.05.1.0
www.analogictech.com
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