ADA10001 Datasheet, PDF (7/8 Pages) ANADIGICS, Inc – Linear Amplifier MMIC

PACKAGE OUTLINE
D
ADA10001
C
LE
EH
A
e
B1
S _YM
B _OL
A
A1
A2
B
B₁
C
D
E
e
H
L
LE
a
INCHES
MIN.
0.058
MAX.
0.068
0.004 0.010
0.055 0.065
0.013 0.020
0.062 0.070
0.008 0.010
0.380 0.400
0.150 0.160
0.050 BSC
0.226 0.244
0.016 0.040
0.030
0
8
MILLIMETERS
MIN.
1.47
MAX.
1.73
0.10
0.25
1.40
1.65
0.33
0.50
1.58
1.78
0.20
0.25
9.66 10.16
3.81
4.06
1.27 BSC
5.74
6.20
0.41
1.02
0.76
0
8
NOTE
4
2
3
0.015 [0.38]X45
L
a
A2
A1
GAUGE PLANE
0.003 [0.076mm]
SEATING PLANE
B
NOTES:
1. CONTROLLING DIMENSION: INCHES
2. DIMENSION "D" DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS
AND GATE BURRS SHALL NOT EXCEED 0.006 [0.15mm]
PER SIDE.
3. DIMENSION "E" DOES NOT INCLUDE INTER-LEAD FLASH OR
PROTRUSIONS. INTER-LEAD FLASH AND PROTRUSIONS
SHALL NOT EXCEED 0.010 [0.25mm] PER SIDE.
4. LEAD THICKNESS AFTER PLATING TO BE 0.013 [0.33mm]
MAXIMUM.
SPECIFICATION: 98000-006
SUBJECT: PUBLISHED OUTLINE,
16 LEAD BATWING SOIC PKG.
Figure 10: S3 Package Outline - Modified 16 Pin SOIC
Data Sheet - Rev 2.3
7
02/2005