AWT6314R_08 Datasheet, PDF (1/8 Pages) ANADIGICS, Inc – Dual-band CDMA/PCS 3.4 V/28 dBm Linear Power Amplifier Module

FEATURES
• Single Mode Operation: POUT  +28 dBm
• High Efficiency: 39 %
• 25 % Package Size Reduction
• Common VMODE Control Line
• Simplified VCC Bus PCB routing
• Reduced External Component Count
• Low Profile Surface Mount Package: 1.1 mm
• RoHS Compliant Package, 250 ^oC MSL-3
APPLICATIONS
• CDMA/EVDO Cell & PCS dual-band Wireless
Handouts and Data Devices
AWT6314R
Dual-band CDMA/PCS 3.4 V/28 dBm
Linear Power Amplifier Module
Data Sheet - Rev 2.0
AWT6314
M23 Package
12 Pin 3 mm x 5 mm x 1 mm
Surface Mount Module
PRODUCT DESCRIPTION
The AWT6314R meets the increasing demands for
higher levels of integration in dual-band CDMA/PCS
1X handsets, while reducing board area requirements
by 25 %. The package pinout was chosen to enable
handset manufacturers to easily route VCC to both
power amplifiers and simplify control with a common
VMODE pin. The device is manufactured on an advanced
InGaP HBT MMIC technology offering state-of-the-art
reliability, temperature stability, and ruggedness.
Selectable bias modes that optimize efficiency for
different output power levels, and a shutdown mode
with low leakage current, serve to increase handset
talk and standby time. The self contained 3 mm x 5 mm
x 1 mm surface mount package incorporates matching
networks optimized for output power, efficiency and
linearity in a 50 Ω system.
VREF_PCS 1
RFIN_PCS 2
GND at slug (pad)
Bias Control
12 RFOUT_PCS
11 GND
VCC1 3
10 VCC2
VMODE ₄
9 _{VCC2 A}
RFIN_CELL 5
8 RFOUT_CELL
VREF_CELL ₆
Bias Control
7 GND
GND
Figure 1: Block Diagram
09/2008