AWT6221R Datasheet, PDF (1/8 Pages) ANADIGICS, Inc – HELP3TM Dual-band Cellular/PCS UMTS 3.4 V HSPA Linear Power Amplifier Module

FEATURES
• InGaP HBT Technology
• High Efficiency:
19 % @ +16 dBm POUT
40 % @ maximum POUT
• Low Quiescent Current: 8 mA
• Internal Voltage Regulation
• Common VMODE Control Line
• Simplified VCC Bus PCB routing
• Reduced External Component Count
• Low Profile Surface Mount Package: 1 mm
• HSDPA Compliant
• RoHS Compliant Package, 250 ^oC MSL-3
AWT6221R
HELP3^TM Dual-band Cellular/PCS UMTS
3.4 V HSPA Linear Power Amplifier Module
DATA SHEET - Rev 2.3
AWT6221R
APPLICATIONS
• WCDMA/HSPA Dual-Band Cell/PCS Wireless
Handsets and Data Devices
PRODUCT DESCRIPTION
The AWT6221R addresses the demand for increased
integration in dual-band handsets for North American
UMTS network deployments. The small footprint 3
mm x 5 mm x 1 mm surface mount RoHS compliant
package contains independent RF PA paths to ensure
optimal performance in both frequency bands, while
achieving a 25% PCB space savings compared with
solutions requiring two single-band PAs. The package
pinout was chosen to enable handset manufacturers
to easily route VCC to both power amplifiers and
simplify control with a common VMODE pin. The
device is manufactured on an advanced InGaP HBT
MMIC technology offering state-of-the-art reliability,
temperature stability, and ruggedness. The AWT6221R
incorporates ANADIGICS’ HELP3™ technology to
provide low power consumption without the need for
an external voltage regulator. Two operating modes
provide optimum efficiency at high and medium/low
power output levels, thereby dramatically increasing
handset talk-time and standby-time. Its built-in voltage
regulator eliminates the need for external voltage
regulation and load switches. The 3 mm x 5 mm x 1
mm surface mount package incorporates matching
networks optimized for output power, efficiency and
linearity in a 50 Ω system.
M28 Package
14 Pin 3 mm x 5 mm x 1 mm
Surface Mount Module
Figure 1: Block Diagram
11/2008