AN-0001 Datasheet, PDF (1/6 Pages) ANADIGICS, Inc – Surface Mount Assembly and Handling of ANADIGICS LPCC Packages

Assembly of LPCC Packages
AN-0001
Surface Mount Assembly and Handling of
ANADIGICS LPCC Packages
1.0 Overview
ANADIGICS power amplifiers are typically packaged in a Leadless Plastic Chip Carrier (LPCC) package.
These LPCC packages have two types of pads, mounting pads and a thermal pad, both of which must be
correctly soldered for proper electrical contact to the PCB. The appropriate steps should be taken during
PCB design and assembly to guarantee optimum performance from the power amplifiers. This
application note outlines the steps necessary for the handling and assembly of ANADIGICS power
amplifiers.
2.0 Requirements
2.1 PCB Design Guidelines:
1. PCB land and solder masking recommendations are shown in Figure 1.
A
B
SOLDER MASK
PCB THERMAL PAD
PCB LAND
SOLDER MASK OPENING
E
C
D
A = Clearance from PCB thermal pad to solder mask opening, 0.0635 mm minimum
B = Clearance from edge of PCB thermal pad to PCB land, 0.2 mm minimum
C = Clearance from PCB land edge to solder mask opening to be as tight as
possible to ensure that some solder mask remains between PCB pads
D = PCB land length = LPCC solder pad length + 0.1mm
E = PCB land width = LPCC solder pad width
Figure 1. PCB Land and Solder Mask Recommendations.
05/2003