TSL257T Datasheet, PDF (9/11 Pages) TEXAS ADVANCED OPTOELECTRONIC SOLUTIONS – HIGH-SENSITIVITY LIGHT-TO-VOLTAGE CONVERTER

TSL257T
HIGH-SENSITIVITY
LIGHT-TO-VOLTAGE CONVERTER
TAOS065B − APRIL 2007
MANUFACTURING INFORMATION
The reflow profile specified here describes expected maximum heat exposure of devices during the solder
reflow process of the device on a PWB. Temperature is measured at the top of the device. Devices should be
limited to one pass through the solder reflow profile.
Table 1. TSL257T Solder Reflow Profile
PARAMETER
Average temperature gradient in preheating
Soak time
lid ^{Time above T1, 217°C}
Time above T₂, 230°C
Time above T₃, (T_peak −10°C)
a _{Peak temperature in reflow}
v Temperature gradient in cooling
REFERENCE
t_soak
t₁
t₂
t₃
T_peak
TSL257T
2.5°C/sec
2 to 3 minutes
Max 60 sec
Max 50 sec
Max 10 sec
260° C (−0°C/+5°C)
Max −5°C/sec
till Tpeak
T₃
G _{s T2}
A ^t _T1
Not to scale — for reference only
Technicaaml ^{sconten Time(sec)}
t₃
t₂
t_soak
t₁
Figure 10. TSL257T Solder Reflow Profile
Copyright E 2007, TAOS Inc.
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www.taosinc.com
The LUMENOLOGY r Company
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