ASCELL3911 Datasheet, PDF (8/13 Pages) ams AG – ISM 868 MHz, 433 MHz and 315 MHz FSK Transmitter

ISM 868 MHz, 433 MHz and 315 MHz FSK Transmitter – Preliminary Data Sheet
ASCell3911
5
GP
6
GP
Table 2:
Control bit description.
Austria Mikro Systeme International AG
Single message transmission: After completing the data transmission to the ASCell3911, the
µC may indicate ”end of transmission” by setting P4 (not end of transmit) to ”L” and pulls the
WAKEUP line to ”L”. Sensing this, 4 clock cycles later the ASCell3911 will switch the µC back to
standby mode, disabling the µC_CLK output, setting the active WAKEUP pin to ”L”. The AS-
Cell3911 will finish the transmission sequence and than turning off the XTAL oscillator to and
goes back to the standby mode too. The SMT/CMT bit is ”L” indicates the single transmission
mode.
Note: SMT/CMT is one bit of the control information.
Continuous message transmission: After completing the data transmission to the AS-
Cell3911, the µC may indicate ”end of transmission” by setting P4 to ”L” and pulls the WAKEUP
line to ”L”. Sensing this, 4 clock cycles later the ASCell3911 will switch back to standby mode,
disabling the µC_CLK output, setting the active WAKEUP pin to ”L” and than turning off the XTAL
oscillator. The SMT/CMT bit is ”H” indicates the continuous transmission mode.
Note: SMT/CMT is one bit of the control information.
Due to the sophisticated tri-state - active/inactive pull-up configuration of the WAKEUP pin the
ASCell3911 does not drain current during its standby periods.
The interface implemented in the ASCell3911 system cell is a general, non-specialized example
only. It can be modified on customers demand.
2 Electrical Characteristics
2.1 Absolute Maximum Ratings (non operating)
Symbol
Parameter
Min
Max
VDD; VDDSYN Positive supply voltage
-0,5
6
GND; GNDSYN Negative supply voltage
0
0
Vin
Voltage at every input pin
Gnd-0,5 VCC+0,5
Iin
Input current into any pin except
-10
10
supply pins
ESD
Electrostatic discharge
1k
ESD_IN
Electrostatic discharge of RF pins
500
Tstg
Storage temperature
-55
125
Tlead
Lead temperature
260
Units
V
V
V
mA
Note
Latch-up Test
V
1) 3)
V
1) 4)
°C
°C
2)
1) Test according to MIL STD 883C, Method 3015.7. HBM: R=1,5 kΩ, C=100 pF, 5 positive pulses per pin against supply pin(s), 5
negative pulses per pin against supply pin(s).
2) 260 °C for 10 s (Reflow and Wave Soldering), 360 °C for 3 s (Manual soldering).
3) All pins except RF+, RF-, XTAL.
4) Pins RF+, RF-, XTAL.
Rev. A, February 2000
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