NSE-5310 Datasheet, PDF (19/21 Pages) ams AG – Miniature Position Encoder SOIC with Zero Reference and I²C Output

NSE-5310
Data Sheet - Package Drawings and Markings
Custom chip-on-board packaging can be provided for qualified OEMs. Minimum order quantities apply. Inquire for more detail.
Figure 16. Custom Chip-On-Board Packaging (5.4 x 4.2 x 0.6 mm)
Centerline of
sensor Array
Magnet centered
on hall elements
0.62 mm
Centerline
of IC
2 mm
0.5 mm
4.2 mm
Custom wafer-level chip scale packaging can be provided for qualified OEMs. Minimum order quantities apply. Inquire for more detail.
Figure 17. Custom Wafer-Level Chip Scale Packaging (as small as 3.9 x 2.5 x 0.6 mm)
Centerline of
sensors
Magnet centered
on hall elements
1.13 mm
0.62 mm
Centerline
of IC
2 mm
0.5 mm
Gap .26 +/-.2 mm
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Revision 1.0
19 - 21