AS1369_04 Datasheet, PDF (16/22 Pages) ams AG – 200mA Ultra-Compact Low Dropout Regulator

AS1369
Datasheet - Application Information
8.4 Junction Temperature
Under all operating conditions, the maximum junction temperature should not be allowed to exceed 125°C (unless otherwise specified in the
datasheet). Limiting the maximum junction temperature requires knowledge of the heat path from junction to case (_JC°C/W fixed by the IC
manufacturer), and adjustment of the case to ambient heat path (_CA°C/W) by manipulation of the PCB copper area adjacent to the IC position.
Figure 48. Package Physical Arrangements
CS-WLP Package
Chip
Package
ill ^PCB
Transfer Layer
Solder Balls
AG ^{t st} _{Figure 49. Steady State Heat Flow Equivalent Circuit}
ams nten Junction
TJ°C
Package
TC°C
PCB/Heatsink
TS°C
Ambient
TA°C
l ^co _Chip
a ^Power
R_JC
R_CS
R_SA
chnic _{Total Thermal Path Resistance:}
Te ^{Junction Temperature (TJ ºC) is determined by:}
RJA = RJC + RCS + RSA
TJ = (PD_(MAX) x RJA) + TAMB ºC
valid
(EQ 7)
(EQ 8)
www.austriamicrosystems.com/LDOs/AS1369
Revision 1.7
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