BUF634_12 Datasheet, PDF (10/20 Pages) Burr-Brown (TI) – 250mA HIGH-SPEED BUFFER

PACKAGE OPTION ADDENDUM
www.ti.com
26-Mar-2010
PACKAGING INFORMATION
Orderable Device
BUF634F
BUF634F/500
BUF634F/500E3
BUF634FKTTT
BUF634FKTTTE3
BUF634P
BUF634PG4
BUF634T
BUF634TG3
BUF634U
BUF634U/2K5
BUF634U/2K5E4
BUF634UE4
Status ⁽¹⁾
OBSOLETE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package
Type
DDPAK/
TO-263
DDPAK/
TO-263
DDPAK/
TO-263
DDPAK/
TO-263
DDPAK/
TO-263
PDIP
Package
Drawing
KTT
KTT
KTT
KTT
KTT
P
ACTIVE
PDIP
P
ACTIVE TO-220
KC
ACTIVE TO-220
KC
ACTIVE
SOIC
D
ACTIVE
SOIC
D
ACTIVE
SOIC
D
ACTIVE
SOIC
D
Pins Package Eco Plan ⁽²⁾
Qty
5
TBD
Lead/Ball Finish MSL Peak Temp ⁽³⁾
Call TI
Call TI
5 500
5 500
5
50
Pb-Free
(RoHS)
Pb-Free
(RoHS)
TBD
CU SN
CU SN
Call TI
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Call TI
5
50
TBD
Call TI
Call TI
8
50 Green (RoHS & CU NIPDAU N / A for Pkg Type
no Sb/Br)
8
50 Green (RoHS & CU NIPDAU N / A for Pkg Type
no Sb/Br)
5
49
TBD
Call TI
Call TI
5
49
TBD
Call TI
Call TI
8
75 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
8 2500 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
8 2500 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
8
75 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check}
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) _{MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder}
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
Addendum-Page 1