T3638-004 Datasheet, PDF (20/52 Pages) Amphenol Corporation – Amphenol-Tuchel Electronics GmbH

C 091 B
Characteristics
General Characteristics
Number of contacts
View on termination side
of contact insert
Contact arrangement acc. to DIN
Contact arrangement acc. to IEC
Electrical Characteristics
Rated voltage
Rated voltage
Rated impulse withstand voltage
Pollution degree
Installation category
Insulation group
Current rating
Insulation resistance
Contact resistance
Climatic Characteristics
Climatic category
Temperature range
Mechanical Characteristics
IP-degree
Insertion and withdrawal forces
Mechanical operation
Materials
Housing material
Dielectric material
Contact plating
Further Characteristics
Termination technique
Wire gauge
Flammability
Locking system
Standard Characteristics
3
4
5 5 Stereo 6
7
7
8
12
14
2
1
3
23
1
4
3
2
4
15
425
1
3
3
2
4
6
15
4
5
3
6
7
1
2
425
1
3
67
425
183
67
41 524 –
– 41 524 45 322 – 45 329 45 326 –
–
60130-9 60130-9 – 60130-9 60130-9 – 60130-9 60130-9 –
–
IEC 60664-1
UL 1977
IEC 60664-1
IEC 60664-1
IEC 60664-1
IEC 60664-1
IEC 60512-5-2
Test 5 b
UL 1977
IEC 60512-3-1
Test 3 a
IEC 60512-2-1
Test 2 a
300 V ^–~
1500 V
100 V ^–~
300 V ^–~
250 V
1200 V
1500 V
1
I
II, 400 ≤ CTI < 600
5 A / + 40 °C / + 104 °F
please refer also to current derating curves page 45
> 10 ¹⁰ Ω
<5mΩ
150 V ^–~
60 V
1200 V
3 A / + 40 °C /
+ 104 °F
IEC 60668-1
IEC 60668-1
40 / 100 / 56
- 40 °C ... + 100 °C / - 40 °F ... + 212 °F
IEC 60529
IEC60512-13-2 25 N
Test 13 b
90.oz
IEC 60512
Test 9 a
30 N
110.oz
35 N
125.oz
IP 40
50 N
180.oz
55 N
200.oz
Silver ≥ 500 mating cycles
Gold ≥ 1000 mating cycles
die cast, nickel plated
thermoplastic
silver plated / gold plated *
60 N
220.oz
50 N
180.oz
solder, crimp
solder: ≤ 0,5 mm² / 20 AWG
crimp: 2 - 6 pol (excluding 5S): 0,09 - 1,00 mm² / 28 - 18 AWG
crimp: 5S, 7, 7S and 8-pol.: 0,09 - 0,75 mm² / 28 - 20 AWG
UL 94 V0
bayonet
solder
≤ 0,25 mm²/24 AWG
Caution: Do not connect or disconnect under load. Metal housing parts shall be securely incorporated to protected ground.
* Remark for gold plated contacts: In order to avoid brittle inter-metallic connections, gold-plated terminals have to be tin-plated in the solder area.
IEC 60 664 ^{^=} DIN VDE 0110 ; IEC 60 512-x ^{^=} DIN EN 60 512-x
20
Amphenol