L77HDE15SD1CH4R Datasheet, PDF (1/4 Pages) Amphenol Corporation – D-Sub connectors - Stamped and Formed Contacts

HD
D-Sub connectors - Stamped and Formed Contacts
RIGHT ANGLE
HIGH DENSITY CONNECTORS
Specifications
• Connectors according to: MIL C24308
• UL File: E149426
Shells
Insulator
Contacts
Rear insert
Boardlock
Screwlock
Materials and Platings
Steel, tin over nickel plating
Glass-filled thermoplastic, UL 94V- 0
Brass, selected gold in mating area;
2.54µm (100 µ") min.tin on
termination area over 1.27µm
(50µ") min.nickel
Brass, 2.54µm (100µ") min.nickel plated
Phosphor bronze or Brass, 2.54µm
(100µ") min.nickel plated
Brass, 2.54µm (100µ") min.nickel plated
Current rating
Voltage rating
Withstanding voltage
Insulation resistance
Contact resistance
Electrical Data
3A
250V AC/ rms 50Hz
1000V AC/rms 50Hz for one minute
5000MΩ at 500V DC
10mΩ max
Climatic Data
Operating temperature -55°C to +125°C
Salt spray
24 hours
Mechanical Data
Single contact insertion force 0.34kg (0.75lb) max.
Single contact withdrawal force 0.02kg (0.044lb) min.
Mating and unmating force
Unit: kg ( lb)
No. of Cts
15
26
44
62
Mate (max)
3.81 (8.42)
5.95 (13.16)
9.26 (20.46)
13.48 (29.78)
Unmate (min)
0.52 (1.14)
1.05 (2.32)
1.37 (3.02)
1.76 (3.88)
Standard plating thickness
• Gold flash
• 0.4µm (15µ") Gold
• 0.76 µm (30µ") Gold
Amphenol’s high density
D-Sub connectors complement
Amphenol’s extensive D-Sub
connector line. This line offers many
superior features, high performance
level and low installation cost.
The decreased contact spacing
accommodates greater signal
density in comparison to conventional
D-Sub connectors.
Economical
right angle PCB
mount
connectors
• Industrial
• Telecom
• Any industry standard
I / O connections