L77HDE15S Datasheet, PDF (1/4 Pages) Amphenol Corporation – SOLDER-CUP TERMINATION STANDARD and HIGH DENSITY

SD
D'Sub connectors - Stamped and Formed Contacts
SOLDER-CUP TERMINATION
STANDARD and HIGH DENSITY
Specifications
• UL File: E232356
• Connectors according to MIL C24308
Shells
Insulator
Contacts
Rear insert
Screwlock
Materials and Platings
Steel, tin over nickel plating
Glass-filled thermoplastic, UL 94V-0
Brass, selected gold in mating area;
2.54µm (100µ") min. tin
on termination area over
1.27µm (50µ") min. nickel
Brass, 2.54µm (100µ") min. nickel plated
Brass, 2.54µm (100µ") min. nickel plated
Current rating
Voltage rating
Withstanding voltage
Insulation resistance
Contact resistance
Electrical Data
Standard Density: 5A
High Density: 3A
250V AC/rms 50Hz
1000V AC/rms 50Hz for one minute
1000MΩ at 500V DC
20mΩ max
Climatic Data
Operating temperature -55°C to +125°C
Salt spray
24 hours
Mechanical Data
Single contact insertion force
Single contact withdrawal force
Mating and unmating force
Unit: kg ( lb)
0.54kg (1.19lb) max
SD : 0.06kg (0.13lb) min
HD : 0.02kg (0.044lb) min
No. of Cts
SD HD
9 15
15 26
25 44
37 62
50 78
SD
HD
Mate (max) Unmate (min) Mate (max) Unmate (min)
3.05 (6.74)
5.09 (11.24)
8.44 (18.66)
12.51 (27.65)
14.65 (32.38)
0.36 (0.79)
0.46 (1.01)
0.81 (1.8)
1.1 (2.47)
1.6 (3.56)
3.81 (8.42)
5.95 (13.16)
9.26 (20.46)
13.48 (29.78)
15.82 (34.96)
0.52 (1.14)
1.05 (2.32)
1.37 (3.02)
1.76 (3.88)
2.02 (4.46)
Standard plating thickness
• gold flash
• 0.4µm (15µ") gold
• 0.76 µm (30µ") gold
The Amphenol "SD" series features
precision formed contacts, and
insulator with closed entry contacts
cavities.
This series gives you Amphenol's
high standards of quality and reliability
to meet all of your commercial
requirements.
Economical
solder cup
connectors
• Industrial
• Telecom
• Any industry standard
I / O connections