C10-642495-241 Datasheet, PDF (1/2 Pages) Amphenol Corporation – Amphenol Industrial RADSOK Products for Printed Circuit Boards

Product Data Sheet
Amphenol^® Industrial RADSOK^® Products for
Printed Circuit Boards
No. 205
PROBLEM: With conventional interconnects, users often cannot handle the higher power requirements of
modern electronics board applications. A common solution to increase amperage to the board is to increase
the thickness of the copper layers (i.e. traces) in the PCB or backplane. This is usually costly and traps heat
within the PCB. Other options are to bring in additional wires either attached to or plugged into the board
creating a cumbersome wire bundle. The bundle of wire often takes up excessive space behind the board and
doesn’t allow proper air flow, which may cause failures of heat-sensitive components like processors. This
method can be labor intensive and may require special crimping and assembly tools as well.
THE AMPHENOL^® RADSOK^® SOLUTION TO BRING MORE POWER
TO THE BOARD . . . . Three high amperage products: PowerBlok, RADSERT, PGY
Amphenol’s RADSOK^® solution offers many options for high current
single-point connections to printed circuit boards. The compact
footprint design can supply up to 120 Amp to the board which
preserves surface area and provides more flexibility in board design.
The RADSOK^® hyperbolic grid
contact design gives more surface
area with many points of contact for
heat dissipation at the pin and
socket interface.
This lowers temperature rise and
reduces potential failures.
RADSOK^® PCB products are
designed to be applied manually
(press-fit) or by a reflow solder
process, which eliminates the need for additional wires and/or special
crimp tools.
Amphe-Power with RADSOK^® Sockets
Contact Ratings
Size 12
Size 8
Size 4
Size 0
35 Amps
70 Amps
120 Amps
250 Amps
RADSOK^® PCB PowerBlok^TM
RADSOK^® PowerBlok provides a high current single-point connection to the PCB with the
proven reliability of compliant pin signals. The PowerBlok is designed to bring up to 70 Amps to
the board, utilizing our custom 3.0mm RADSOK^® design. The compliant pins are press-fit into
the board to secure a solid connection and even signal flow.
• High power to board interconnect in a small package
• Compact footprint 0.618” x 0.618”
• 3.0mm RADSOK^® carries up to 70 amperes
• Backplane power interface with compliant pins for signals
• Touchproof cover
• Radial design ensures many points of contact
• Reduces failure modes, eliminates burn outs
• No threaded fasteners
• No special crimp tools required
• Eliminates possible stress fractures in board
• Faster through-put
• RoHs compliant
High power density in a small
footprint ( approx. 1/2” x 1/2”)
Tooled to 3.0mm (70 amp) size
Sample part number: C10-639323-000 designates a 3.0mm PowerBlok with compliant pins.