LQFPPOWERQUAD2 Datasheet, PDF (2/2 Pages) Amkor Technology – LQFP PowerQuad® 2 Packages

data sheet
Cross-sections
LQFP PowerQuad^® 2
LEADFRAME
LQFP
PowerQuad^® 2
Process Highlights
Die thickness (max)
15.0 mils
Strip solder plating
85/15 Sn/Pb
Marking
Pad
Lead inspection
Laser/Optical
Pack/ship options
Bar Code/Dry Pack/TNR
Test Services
• Program generation/conversion
• Product engineering
• Wafer sort
• 256 Pin x 20 MHz test system available
• -55 °C to +165 °C test available
• Burn-in
Shipping
Low profile tray (JEDEC Outline CS-007)
Inverted
Configuration Options:
LOW PROFILE POWERQUAD^® 2 PACKAGE FAMILY (mm)
Lead
Count
32
64
80
100
128
128
144
Body
Size
(mm)
7x7
14 x 14
14 x 14
14 x 14
14 x 14
20 x 20
20 x 20
Body
Thickness
(mm)
1.4
1.4
1.4
1.4
1.4
1.4
1.4
Lead
Pitch
(mm)
0.80
0.80
0.65
0.50
0.40
0.50
0.50
Form
Foot Board
Units
Length Tip To Tip Length Standoff JEDEC Tray Per
(mm) (mm) (mm) (mm) Package Matrix Tray
1.0
9.0
0.60
0.10 MS-026 10 x 25 250
1.0
16.0 0.60
0.10 MS-026 6 x 15 90
1.0
16.0 0.60
0.10 MS-026 6 x 15 90
1.0
16.0 0.60
0.10 MS-026 6 x 15 90
1.0
16.0 0.60
0.10 MS-026 6 x 15 90
1.0
22.0 0.60
0.10 MS-026 5 x 12 60
1.0
22.0 0.60
0.10 MS-026 5 x 12 60
w w w. a m ko r. c o m
With respect to the information in this document, Amkor makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. Amkor shall not be responsible for any loss or
damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not in any way extend or modify Amkor’s warranty on any product beyond that set forth in its standard
terms and conditions of sale. Amkor reserves the right to make changes in its product and specifications at any time and without notice.