CSPNL Datasheet, PDF (2/2 Pages) Amkor Technology – Wafer Level Packaging

data sheet
WAFER LEVEL PACKAGING
CSP^nl™ Cross Sections
CSP^nl™
Direct Bump on Pad with Repassivation
Bump on Repassivation/Redistribution
Bump on Thick Repassivation/Redistribution
Process Highlights
Die thickness
0.27mm - 0.45 mm
Redistribution 12 µm line (typ.), 26 µm space (typ.)
Solder sphere diameter 300 µm (typ.), 250 µm (optional)
Bump height
250 µm (typ.), 210 µm (optional)
Solder ball pitch 0.50 mm (typ.), 0.40 mm (optional)
Visual inspection
Wafer map output
Standard Materials
Dielectric material
Polyimide
RDL
Copper
UBM
Ti/Cu/Ni, TiW/Cu/Ni
Solder Composition
Ball Loaded: Pb-Free (Sn/3.9Ag/0.6Cu), Eutectic (63Sn/37Pb),
High Pb (5Sn/95Pb)
Electroplated: Pb-Free (97.5Sn/2.5Ag), Eutectic (63Sn/37Pb),
High Pb (5Sn/95Pb)
Test Services
The CSP^nl™ format allows for wafer sort integration resulting
in reduced cost and improved cycle-time for the customer.
Shipping
CSP^nl™ packaged devices are shipped in standard wafer
magazines or may be singulated for shipment in tape or tray.
Capabilities and Services
Design
• Layout
• Mask tooling
Manufacturing
• Thin film dielectric and metal patterning
• Wafer bumping (electroplated and sphere placement)
• Automated visual inspection
• Wafer map generation
Test
• Test software and hardware development
• Probe card design, service, and support
• Test program transfer
• Wafer sort for memory, logic, and analog applications
Die Processing Integration
and Support
• Wafer saw
• Visual inspection
• Wafer map integration
• PnP to tape or tray
• Shipping material design and supply management
• Turnkey solutions
• Drop ship to final customer
w w w. a m ko r. c o m
With respect to the information in this document, Amkor makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. Amkor shall not be responsible for any loss or
damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not in any way extend or modify Amkor’s warranty on any product beyond that set forth in its standard
terms and conditions of sale. Amkor reserves the right to make changes in its product and specifications at any time and without notice.