WLCSP Datasheet, PDF (1/2 Pages) Amkor Technology – Wafer Level Processing and Die Processing Services

Data Sheet
WAFER LEVEL PACKAGING
Wafer Level Processing &
Die Processing Services (WLP/DPS)
Amkor offers Wafer Level Chip Scale Packaging (WLCSP)
providing a solder interconnection directly between a device
and the motherboard of the end product. WLCSP includes
wafer bumping (with or without pad layer redistribution or
RDL), wafer level final test, device singulation and packing
in tape & reel to support a full turnkey solution. Amkor’s
robust Under Bump Metallurgy (UBM) over PBO or PI
dielectric layers on the die active surface providing a
reliable interconnect solution able to survive harsh board
level conditions meeting the demands of the growing global
consumer market place for portable electronics.
Fueling Growth
• Small packages in mobile are critical to maximize
battery size
• Level of adoption in fastest growing markets
(i.e., tablets and smartphones)
• Dis-integration of high performance functions from
processors to new specialized devices(e.g., audio)
• Fewer cycles through electrical test
• Lower cost to EMS assembly MSL L1 package from T&R
• Improved SMT-compatible underfill processes at EMS
companies increase prior die size limits
The CSP^nl Bump on Repassivation (BoR) option provides
a reliable, cost-
effective, true chip
size package on
devices not requiring
redistribution. The
BoR option utilizes a
repassivation polymer layer with excellent electrical/
mechanical properties. A UBM is added, and solder bumps
are then placed directly over die I/O pads. CSPnl is
designed to utilize industry-standard surface mount
assembly and reflow techniques.
WLCSP
The CSP^nl Bump on Redistribution
option adds a plated copper
Redistribution Layer (RDL) to route I/O
pads to JEDEC/EIAJ standard pitches,
avoiding the need to redesign legacy
parts for CSP applications. A nickel-
based or thick copper UBM offerings, along with polyimide or PBO
dielectrics, provide best in class board level reliability performance. CSPnl
with RDL utilizes industry-standard surface mount assembly and reflow
techniques, and does not require underfill on qualified device size and I/O
layouts.
The CSPⁿ³ option utilizes one layer of
copper for both redistribution and
UBM. This simplified process flow
reduces cost and cycle time by over
20%. CSPn3 has been in production
since 2009 and as of 2015 has a run
rate of over 2.8 billion units since its introduction.
Applications
The WLCSP package family is applicable for a wide range of semiconductor
device types from high end RF WLAN combo chips, to FPGAs, power
management, Flash/EEPROM, integrated passive networks and standard
analog. WLCSP offers the lowest total cost of ownership enabling higher
semiconductor content while leveraging the smallest form factor and one of
the highest performing, most reliable, semiconductor package platforms on
the market today. WLCSP is ideally suited for, but not limited to, mobile
phones, tablets, netbook PCs, disk drives, digital still & video cameras,
navigation devices, game controllers, other portable/remote products and
some automotive end applications.
Wafer Level Features
• 4-196 ball count
• Small body 0.64 mm² to large 50.0 mm² body size
• PBO & Polyimide (PI) Repassivation and Redistribution Layer (RDL)
available
• Electroplated Sn/Ag < 0.3 µm and SAC Alloy ball-loaded bumping options
≥ 0.3 µm pitch
• Reliable thick Cu UBM or Ni/Au for best in class EM performance
• Compatible with conventional SMT assembly and test techniques
Die Level Features
• Best in class component and board level reliability
• JEDEC tested board level performance demonstrated without underfill
• Precision edge quality ensuring device integrity at board mount
• Back-side laminate coating available
• Cost effective T&R packaging solutions for small ICs
• Ultra-thin backgrinding for embedded die applications
• Full turnkey WLP, contact probe and DPS supported in Taiwan, China and
Korea
• Wide selection of pocket tape carrier options
Visit Amkor Technology online for locations and
to view the most current product information.
DS720H
Rev Date: 1/16
Questions? Contact us: [e-mail]