SSOP Datasheet, PDF (1/2 Pages) Amkor Technology – Shrink Small Outline, Quarter-Size Small-Outline Packages

Data Sheet
LEADFRAME
SSOP/QSOP
Shrink Small Outline,
Quarter-Size Small-Outline Packages
(SSOP/QSOP)
SSOP and QSOP are leadframe based, plastic
encapsulated packages that are well suited for applications
requiring optimum performance in IC packaging with
compressed body size and tightened lead pitch. These
industry standard IC packages yield a significant reduction
in size while running in high volume and provide value
added low cost solutions for a wide range of applications. A
green BOM is standard, allowing devices to meet applicable
Pb-free and RoHS standards.
Features
• Cu wire interconnect for low cost
• Standard JEDEC package outlines
• Multi-die production capability
• Turnkey test services, including strip test options
• Green materials are standard – Pb-free and RoHS
compliant
New Developments
• Stealth dicing (narrow saw streets)
• Larger/higher density leadframe strips
• Leadframe roughening for improved MSL capability
Services and Support
Amkor has a broad base of resources available to help
customers bring quality new products to market quickly and
at the lowest possible cost.
• Full package characterization
• Thermal, mechanical stress and electrical performance
modeling
• Turnkey assembly, test and drop ship
• World class reliability testing and failure analysis
Thermal Performance
Forced Convection, Single-layer PCB
Pkg
Body Size
(mm)
20 ld
3.9 x 8.7
28 ld
5.3 x 10.2
JEDEC Standard Test Boards
Pad Size
(mm)
2.4 x 3.6
3.84 x 8.10
ΘJA (°C/W) by Velocity (LFPM)
0
200
500
80.8
73.2
69.2
49.0
36.0
30.0
Electrical Performance
Body
Pkg Size
(mm)
Pad
Size
(mm)
20 ld 5.3 x 7.2 3.9 x 5.4
28 ld 3.9 x 9.9 2.4 x 4.8
28 ld 5.3 x 10.2 3.9 x 5.1
Simulated Results @ 100 MHz
Lead
Longest
Shortest
Longest
Shortest
Longest
Shortest
Self
Bulk
Self
Inductance Capacitance Resistance
(nH)
(pF)
(mF)
2.260
0.395
19.0
0.958
0.209
9.10
1.590
0.376
14.1
0.757
0.198
7.53
2.510
0.463
21.5
0.928
0.206
9.57
Reliability Qualification
Amkor package qualification uses three independent production lots and a
minimum of 77 units per test group. All testing includes JSTD-020 moisture
preconditioning.
• Moisture Sensitivity
JEDEC Level 1, 85°C/85% RH, 168 hrs
Characterization
JEDEC Level 3, 30°C/60% RH, 192 hrs
• uHAST
130°C/85% RH, No Bias, 96 hrs
• Temp Cycle
-65°C/+150°C, 500 cycles
• High Temp Storage
150°C, 1000 hours
Process Highlights
• Pcc wire bonding standard, Ag wire available
• Wafer backgrinding services available
• Multiple die and die stacking capability
• NiPdAu (PPF) or Matte Sn lead finish options
• Laser mark on package body
Visit Amkor Technology online for locations and
to view the most current product information.
DS360N
Rev Date: 7/15
Questions? Contact us: [e-mail]