POWERSOP Datasheet, PDF (1/2 Pages) Amkor Technology – Power Small Outline Package,PowerSOP

Data Sheet
LEADFRAME
Power Small Outline Package,
PowerSOP^® (PSOP3)
PSOP3 is a leadframe based, plastic encapsulated package
that is well suited for applications requiring optimum
performance in IC packaging. This industry standard
package utilizes a thick copper heat slug to accommodate
the needs of higher power devices. A green BOM is
standard, allowing devices to meet applicable Pb-free and
RoHS standards.
Features
• Cu wire interconnect for low cost
• Standard JEDEC package outlines
• Multi-die production capability
• Turnkey test services
• Green materials are standard – Pb-free and RoHS
compliant
• Theta JC of under 1°C/W can be achieved with optimal
heatsinking
• Highly conductive copper heat-slug and leadframes
• PSOP3 package has optional soft solder die attach for
enhanced power capability
New Developments
• Stealth dicing (narrow saw streets)
• Leadframe roughening for improved MSL capability
Services and Support
Amkor has a broad base of resources available to help
customers bring quality new products to market quickly and
at the lowest possible cost.
• Full package characterization
• Thermal, mechanical stress and electrical performance
modeling
• Turnkey assembly, test and drop ship
• World class reliability testing and failure analysis
PowerSOP^® 3
Thermal Performance
Forced Convection, Single-layer PCB
Pkg
Die Size
(mm)
S/NS
S
20 ld
5.1 x 5.1
NS
ΘJA (°C/W) by Velocity (LFPM)
0
200
500
50.8
35.7
27.8
52.4
37.6
28.8
Forced Convection, Multi-layer PCB
Pkg
Die Size
(mm)
S/NS
S
20 ld
5.1 x 5.1
NS
S = Slug soldered to test board
NS = Slug not soldered to test board
JEDEC Standard Test Boards
ΘJA (°C/W) by Velocity (LFPM)
0
200
500
19.2
14.2
12.2
25.7
20.4
17.8
Electrical Performance
Body
Pkg Size
(mm)
Pad
Size
(mm)
Lead
Inductance Capacitance Resistance
(nH)
(pF)
(mF)
20 ld 11 x 15.9
7.5 x 7.9
Longest
Shortest
3.130
1.540
1.990
0.604
30.6
9.42
Simulated Results @ 100 MHz
Reliability Qualification
Amkor package qualification uses three independent production lots and a
minimum of 77 units per test group. All testing includes JSTD-020 moisture
preconditioning.
• Moisture Sensitivity
Characterization
JEDEC Level 3, 30°C/60% RH, 192 hrs
• uHAST
130°C/85% RH, No Bias, 96 hrs
• Temp Cycle
-65°C/+150°C, 500 cycles
• High Temp Storage
150°C, 1000 hours
Process Highlights
• Pcc wire bonding standard, Ag wire available
• Wafer backgrinding services available
• Multiple die and die stacking capability
• NiPdAu (PPF) or Matte Sn lead finish options
• Laser mark on package body
Visit Amkor Technology online for locations and
to view the most current product information.
DS320K
Rev Date: 3/15
Questions? Contact us: [e-mail]