MQFPPOWERQUAD2 Datasheet, PDF (1/2 Pages) Amkor Technology – Exceptional thermal and electrical performance by design include the following

data sheet
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MQFP PowerQuad^® 2
Packages:
The MQFP PowerQuad^® 2 (PQ2) is patented,
advanced IC packaging technology with
excellent attributes in thermal and electrical
performance. Extraordinary gains in power
dissipation and speed are achieved through
the use of an innovative, integrated, embedded
copper heatsink. The IC is attached directly to
this large, highly efficient heatsink which
readily extracts generated heat under demand
situations. To enhance the thermal conduction
from the IC to the mounting surface, the internal
package leads are mechanically connected, yet
electrically isolated, by a proprietary process
to the heatsink. Thermal resistance improve-
ments greater than 50% can be realized with
this technology without the use of any external
cooling aids! The large heatsink also provides
a “floating” ground plane to the signal leads,
reducing self inductance by 50% (over conven-
tional plastic QFPs). Additionally, the patented
PQ2 heatsink has integrated mechanical “locking”
features to ensure package integrity while elimi-
nating moisture penetration. The end result is
a high-power, high-speed IC package with the
properties to enable new electronic products and
emerging end applications to move from concept
to production.
Features:
MQFP
PowerQuad^® 2
Exceptional thermal and electrical performance by design include
the following:
• Very high conductive, solid copper heatsink
• 50% reduction in package self inductance
• 64-304 lead counts (14 x 14 mm to 40 x 40 mm body size)
• Industry-accepted JEDEC package outlines
• Low stress mold compound
• Heatsink-up and heatsink-down configurations available
• ~50% improvement in Theta JA over standard MQFP
Thermal Resistance: Multi-Layer PCB
Pkg
100 ld
208 ld
240 ld
304 ld
Theta JA (°C/W) by Velocity (LFPM)
0
200
500
17.6
14.7
13.3
12.6
10.4
9.2
11.8
9.6
8.4
10.3
8.4
7.2
Electrical:
Body
Pkg Size(mm) Lead
100 ld 14 x 20
208 ld 28 x 28
240 ld 32 x 32
304 ld 40 x 40
Longest
Shortest
Longest
Shortest
Longest
Shortest
Longest
Shortest
Simulated Results @ 100 MHz
Self
Inductance
(nH)
4.550
2.560
8.740
5.310
7.710
4.900
12.200
7.280
Bulk
Capacitance
(pF)
1.230
0.768
1.970
1.590
1.580
1.180
2.650
2.040
Self
Resistance
(mΩ)
60.1
26.9
100.0
73.5
87.8
57.3
144.0
93.5
Reliability:
Reliability is of prime importance and long-term performance is
assured by advanced designs, manufacturing process and materials.
• Temp cycle
• Autoclave
• Temp/humidity
• High temp storage
-65/+150 °C, 1000 cycles
121 °C, 2 atm, 504 hours
85 °C/85%RH, 1000 hours
150 °C, 1000 hours
Applications:
Major semiconductor packaging engineers and manufacturers have chosen PowerQuad^® 2 as the IC package of choice for advanced, power micr
processors,DSPs, high-speed logic / FPGAs, PLDs, ASICs and other similar technologies. System designers and OEM product developers find PQ2
solves power / thermal / speed concerns while supporting system constraints (standard package outlines, cost, SMT capability, product availability,
technical support). PQ2 is ideal for: PCs, notebooks, high-end audio/video, power supplies, VME CPU board systems, workstations, RISC engine
modules, GUI boards and many other applications.
VISIT AMKOR TECHNOLOGY ONLINE FOR LOCATIONS AND
TO VIEW THE MOST CURRENT PRODUCT INFORMATION.
w w w. a m ko r. c o m
DS185H
Rev Date: 05’06