MQFP Datasheet, PDF (1/2 Pages) STATS ChipPAC, Ltd. – Metric Quad Flat Pack

data sheet
LEADFRAME
Metric Quad Flat
Pack (MQFP)
Packages:
Amkor’s MQFP package portfolio enables
the designer, specifier or systems engineer
the flexibility of growing or shrinking IC
package size based upon application need.
Amkor employs the most up-to-date,
advanced equipment, material and
processes to assure successful, reliable
performance of your IC chips. Having a
complete line of MQFPs available and at
your disposal means security and conven-
ience. Sourcing them from Amkor means
success.
Thermal
Enhancement:
Some designs and applications require an
added margin of thermal performance
(power). Amkor’s easy and cost-effective
solution is a heatspreader. This optional
embedded thermal aid improves Theta JA
by greater than 15% (without external
heatsinks or fans) by increasing the heat
dissipation path from the IC chip to the
PCB.
Applications:
Amkor’s MQFP line is adapted to meet the
increasing challenges of advancing proces-
sors/controllers, DSP, ASIC, video-DAC, PC
chip-sets, gate arrays, logic, multi-media
and other technologies. These packages fill
many end application needs in consumer,
commercial, office, automotive, PC, indus-
trial and other product areas.
Features:
MQFP
Amkor’s MQFP IC package portfolio provides:
• 10 x 10 mm to 40 x 40 mm body size
• 44 to 304 lead counts
• Hi-conductivity copper leadframes
• Die up and down configurations
• JEDEC standard compliant
• Wide selection of leadframe die pad sizes
• Integrated thermal enhancement
• Heatspreader available
• Custom leadframe design available
• Fine pitch wire bond capability
• Lead free option available
Thermal Resistance:
Multi-Layer PCB
Body
Pkg Size (mm)
44 ld 10 x 10
64 ld 14 x 14
JEDEC Standard Test Boards
Pad Size
7.4 x 7.4
8.9 x 8.9
Theta JA (°C/W) by Velocity (LFPM)
0
200 500
38.4 32.1 29.4
33.7 27.9 25.5
Multi-Layer PCB
Body
Pkg Size (mm)
**44 ld 10 x 10
**64 ld 14 x 14
*100 ld 14 x 20
*208 ld 28 x 28
*240 ld 32 x 32
*304 ld 40 x 40
Pad Size
7.4 x 7.4
8.9 x 8.9
11.0 x 11.0
11.0 x 11.0
12.7 x 12.7
11.0 x 11.0
* Pre-JEDEC Standard Test Boards
** JEDEC Standard Test Boards
Theta JA (°C/W) by Velocity (LFPM)
0
200 500
37.5 31.8 29.4
32.7 27.4 25.1
27.3 23.5 21.6
25.7 22.6 20.9
24.5 21.8 20.5
26.8 24.0 22.5
Electrical:
Body Size
Pkg (mm) Lead
44 ld 10 x 10 Longest
Shortest
Simulated Results @ 100 MHz
Inductance
(nH)
1.660
1.460
Capacitance
(pF)
0.322
0.342
Resistance
(mΩ)
19.8
17.0
Reliability:
Amkor’s MQFPs are reliability assured through optimized design, material
and process enabling high performance operation of your IC chip.
• Moisture Sensitivity
Characterization
• PCT
• Temp cycle
• Temp/Humidity
• High temp storage
JEDEC Level 3
30 °C/60% RH, 192 hours
121 °C /100% RH/2 atm., 504 hours
-65/+150 °C, 1000 cycles
85 °C/85% RH, 1000 hours
150 °C, 1000 hours
VISIT AMKOR TECHNOLOGY ONLINE FOR LOCATIONS AND
TO VIEW THE MOST CURRENT PRODUCT INFORMATION.
w w w. a m ko r. c o m
DS250G
Rev Date: 09’02