MICROLEADFRAME Datasheet, PDF (1/3 Pages) Amkor Technology – Saw MLF PEL (Plated End Lead) Package

Data Sheet
LEADFRAME
MicroLeadFrame^®
MLF^®/QFN/SON/DFN
MicroLeadFrame^® Quad Flat No-Lead
Package (MLF^®/QFN/SON/DFN)
Amkor's MicroLeadFrame^® QFN package is a near CSP
plastic encapsulated package with a copper leadframe
substrate. This package uses perimeter lands on the
bottom of the package to provide electrical contact to the
PWB. The package also offers Amkor's ExposedPad
technology as a thermal enhancement. Having the die
attach paddle exposed on the bottom of the package
surface provides an efficient heat path when soldered
directly to the PWB. This enhancement also enables stable
ground by use of down bonds or by electrical connection
through a conductive die attach material.
MLF Offerings
• Chip-on-Lead (COL)
• Single Row (Up to 108 I/O)
• Dual Row (Up to 180 I/O)
• Multi Chip Package
• Non-Exposed Pad
• PPF (NiPd) Punch & Saw MLF
• Small MLF (Less than 2 x 2 body size)
• Stacked Die
• Thin MicroLeadFrame®
• Top Exposed Pad (TEP)
• Inframe Cavity MLF
• Flipchip MLF
Dual Row MLF Package
An MLF package with two rows of leads offers a cost
effective, high performance solution for devices requiring
up to 180 I/O. Typical applications include hard disk drives,
USB controllers and wireless LAN.
Saw MLF PEL (Plated End Lead) Package
Customer demand for Fine lead pitch (0.50 mm, 0.65 mm) is needed in the
automotive Industry. Higher solder fillet height on the side of lead area;
similar or better BLR performance than standard design; no need of X-ray
monitoring after SMD. This process is released to HVM (High Volume
Manufacturing).
FAM (Film Assist Mold) MLF Package
Better release-ability which enables complicated mold structures like cavity-
open packages (Seal film); Protection on brittle surface of die and glass lids
from mechanical impact by cavity insert on mold chase (seal film); resin/mold
flash control (adhesive film).
PQFN (Power) MLF Package
To qualify FET (Field Effect Transistor) devices in QFN package using solder
paste and copper clip; layout and packaging use copper connections for all
power paths rather than wire bonds, reducing losses due to high resistance
wire bonds as well as high inductance which cause ringing and high AC
losses.
RtMLF (Routable Molded Lead Frame) Package
An MLF® package with resin filled traces for small form factor driven
structures. This offers a low cost, high thermal performance device in a
smaller foot print. It has internal routing traces with limited line width/space
capability and this package adapts easily to flipchip configurations. rtMLF
provides higher pin count and more flexible internal trace routing with resin
filled LF. It enable small form factor, high electrical/thermal performance with
low cost.
Visit Amkor Technology online for locations and
to view the most current product information.
DS572Q
Rev Date: 10/15
Questions? Contact us: [e-mail]