MCMPBGA Datasheet, PDF (1/2 Pages) Amkor Technology – Innovative designs and expanding package offerings provide a platform from prototype-to-production

data sheet
L A M I N AT E
MCM-PBGA Packages:
The MCM-PBGA (Multi-Chip Module Plastic Ball Grid
Array) by Amkor incorporates the latest technology
in high-density plastic IC packaging. The high-speed
performance and thermal advantages of the PBGA
package provide the platform to mix semiconductor
technologies such as analog, digital, bipolar, CMOS,
ASIC, memory, etc., in a single IC package.
The affordability of our MCM-PBGAs enable systems
designers to realize their vision of new, advanced
or improved applications. Our designs are optimized
to use standard PBGA package outline tooling to save
you costs and utilize a proven BGA infrastructure.
Additionally, we work with you to produce the most
efficient substrate circuit design that will enhance
the operation and performance of your IC chips.
Our advanced in-house design center and electrical
test support services complete the turn-key solution.
Applications:
Amkor’s MCM-PBGA is an excellent platform for reducing
form factor and size while combining semiconductor
technologies. MCM-PBGAs are perfect for any application
where size, weight, electrical performance, board density
and SMT yields are important considerations, such as
ASICs, cable and DSL modems, wireless telecommunica-
tions and electronic automotive components.
MCM-PBGA
Features:
Innovative designs and expanding package offerings provide
a platform from prototype-to-production.
• Ball counts up to 1156
• 13.0 mm to 40.0 mm body sizes
• 1.00, 1.27 & 1.50 mm ball pitch available
• Perimeter, stagger and full ball arrays
• Special packaging for memory available
• 2, 4, or 6 layer construction, ground / power
• Full in-house design capability
• JEDEC MS-034 standard outlines
• MCM under high volume manufacturing in all sites
• Enhanced electrical performance, shorter signal paths
and reduced package parasitics
• 2-8 active devices
• 200-600 wire bonds
• Passives can be added by utilizing the SMT
equipment located in the SiP line
Thermal Performance:
Multi layer PCB, 0 air flow
PCB
Cu Theta JA
Pkg Body Size Layer Thickness (°C/W)
272 27.0 x 27.0 4
36 µm
19
388 35.0 x 35.0 4
36 µm
16
Amkor assures you reliable performance by continuously
Reliability: _{monitoring key indices:}
• Moisture sensitivity
characterization
• High temp op life
• High temp storage
• Autoclave or unbiased hast
• Temp cycle
JEDEC Level 3
30 °C/60% RH/192 hours
125 °C, 6V, 1000 hours
150 °C, 1000 hours
130 °C/85% RH/96 hours
-55/+125 °C, 1000 cycles
VISIT AMKOR TECHNOLOGY ONLINE FOR LOCATIONS AND
TO VIEW THE MOST CURRENT PRODUCT INFORMATION .
w w w. a m ko r. c o m
DS 540G
Rev Date: 05 ‘07