FUSIONQUAD Datasheet, PDF (1/2 Pages) Amkor Technology – Increased I/O (116 to 356) in smaller package footprints

Data Sheet
LEADFRAME
FusionQuad^®
FusionQuad^® Technology
Amkor’s FusionQuad technology represents a breakthrough
in leadframe-based plastic packaging through the effective
integration of ExposedPad TQFP and MLF technologies.
The novel integration of bottom lands in a QFP provides a
cost-effective platform for increased lead count in a small
form factor. FusionQuad technology not only extends the
I/O range of classic leadframe packaging to nearly 400
unique pins, it also delivers an approximate 50% reduction
in package size for a given lead count. Additionally, this
technology provides excellent RF electrical performance
characteristics with short signal paths to the bottom lands
and high power dissipation capability with the solderable
exposed die attach paddle.
FusionQuad technology offers system architects, IC
designers and packaging engineers a unique blend of
excellent electrical and thermal performance in a
miniaturized cost-effective leadframe plastic package.
Applications requiring increased data rates or RF
communications will benefit from the low insertion loss up
to 10 GHz when utilizing the bottom lands for high speed
signals.
The FusionQuad technology structure also allows the
design of multiple segmented power and ground rings
typically found in many laminate packages today. Along
with the thermal performance advantage of the
ExposedPad TQFP, this technology brings a new lower
cost option to applications normally designed into thermally
enhanced laminate packages. The unique footprint of this
technology allows for the use of low cost printed circuit
boards in the end application due to the space available for
coarse routing vias between the bottom lands and the outer
peripheral leads. The 0.8 mm package thickness allows
FusionQuad technology to be applied to end products
requiring thin profiles such as mobile hard disk drives,
notebook computers and other consumer electronics.
Applications
Amkor’s FusionQuad technology provides an ideal package format for most
IC semiconductor technologies including advanced mixed signal SoCs,
motor drivers, microcontrollers, ASICs, Digital Signal Processors (DSP),
and a variety of others.
This technology is particularly well suited for applications requiring superior
electrical or thermal performance in a cost constrained environment, such
as: hard disk drives, laptop PCs, Ethernet communication, digital television
and data conversion.
Features
• 10 x 10 mm to 24 x 24 mm body sizes
• 0.8 mm & 1.0 mm body thickness
• Increased I/O (116 to 356) in smaller package footprints
• Copper leadframe based
• Integrated exposed die attach pad
• Pb-free/Green
• Flexible designs for optimal electrical and thermal performance
Thermal Performance
Pkg
Body Size
(mm)
Exposed
Pad Size
(mm)
ΘJA (°C/W) by Velocity (m/s)
0
1.0
2.5
176 ld
14 x 14
6.5 x 6.5
24.6
19.9
17.9
JEDEC Standard Test Boards (non-thermally optimized)
Tested @ 1W
Electrical Performance
Body
Pkg Size
(mm)
Pad
Size
(mm)
176 ld 14 x 14 6.5 x 6.5
–
–
–
Simulated Results @ 100 MHz
Lead
Longest
Shortest
Inductance Capacitance Resistance
(nH)
(pF)
(mΩ)
5.99
0.82
209
1.42
0.23
81
Reliability Qualification
Amkor devices are assembled in optimized package designs with proven
reliable semiconductor materials.
• Moisture Sensitivity JEDEC Level 3, 30°C/60% RH, 192 hrs
Characterization
• Temp Cycle
-65°C/+150°C, 1000 cycles
• Temp/Humidity
85°C/85% RH, 1000 hours
• High Temp Storage 150°C, 1000 hours
Visit Amkor Technology online for locations and
to view the most current product information.
DS587D
Rev Date: 7/12