CERPAK Datasheet, PDF (1/1 Pages) Amkor Technology – Ceramic Pack

data sheet
CERAMIC / HERMETIC
Ceramic Pack (CerPak)
Amkor Technology continues to service this
established industry package. The Amkor
Technology CerPak capability provides you, the
customer, with a wide range of lead counts and
body sizes available from various suppliers. The
CerPak is a hermetic package consisting of two
pieces of dry pressed ceramic surrounding a "flat
unformed" leadframe. This package can have
leads extending from two sides of the package
(dual) or extending from four sides of the package
(quad). The ceramic / LF / ceramic system is held
together hermetically by glass The frit lid is
sealed/reflowed over the package cavity at
temperatures between 400° - 460° Centigrade.
Applications:
Along with the other standard industry packages,
the CerPak has a proven track record and is still
being used by semiconductor technologies such as:
Digital to Analog converters, Microwave, Logic,
Memory, Microcontrollers, and Video controllers.
Some end applications are: Military electronics,
Commercial electronics, Consumer electronics,
Automotive and Telecommunications.
Features:
CerPak
The CerPak offers a variety of features:
• 14-256 lead count, 50-30 mil lead pitch's
• Hermetic package
• High thermal conductive ceramic
• Solder Plate lead finish
• JEDEC standard compliant
• Wide selection of available cavity sizes to meet
most die size needs
• Commercial or full Military flows
VISIT AMKOR TECHNOLOGY ONLINE FOR LOCATIONS AND
TO VIEW THE MOST CURRENT PRODUCT INFORMATION.
w w w. a m ko r. c o m
DS802
Rev Date: 08’02