CDIP Datasheet, PDF (1/1 Pages) Amkor Technology – Ceramic Dual-Inline Package

data sheet
CERAMIC / HERMETIC
Ceramic Dual-Inline Package
(CDIP / CerDIP)
Amkor Technology is committed to continuing to
service this long established standard industry
package. The Amkor Technology CDIP capability
provides a wide range of lead counts and body
sizes. The CDIP is a hermetic package consisting of
two pieces of dry pressed ceramic surrounding a
"DIP formed" leadframe. The ceramic / LF /
ceramic system is held together hermetically by
frit glass reflowed at temperatures between
400° - 460° Centigrade.
Applications:
Along with the other standard industry packages,
the CDIP has a proven track record and is still
being used by semiconductor technologies such as:
Digital to Analog converters, EPROMS, Air bag
sensors, Logic, Memory, Microcontrollers, and
Video controllers. Some end applications are:
Military electronics, Commercial electronics,
Automotive and Telecommunications.
Features:
CDIP / CerDIP
The CDIP offers a variety of features:
• 300 mil package body width with lead counts
from 8L to 28L
• 400 mil package body width with lead counts
of 22L & 24L
• 600 mil package body width with lead counts
from 24L to 40L
• 100 mil lead pitch
• High thermal conductive ceramic
• Matte Tin lead finish
• JEDEC standard compliant
• Wide selection of available cavity sizes to meet
most die size needs
• Commercial or full Military flows
VISIT AMKOR TECHNOLOGY ONLINE FOR LOCATIONS AND
TO VIEW THE MOST CURRENT PRODUCT INFORMATION.
w w w. a m ko r. c o m
DS801
Rev Date: 08’02