CBGA Datasheet, PDF (1/1 Pages) Amkor Technology – From innovative designs and expanding package offerings, Amkor provides a platform from prototype-to-production.

data sheet
CERAMIC / HERMETIC
Ceramic Ball Grid Array
Package (CBGA)
Amkor's CBGAs incorporate the most advanced
assembly processes and designs for today and
tomorrow's cost/performance applications. This
advanced IC package technology allows
application and design engineers to optimize
innovations while maximizing the performance
characteristics of semiconductors (Si & GaAs).
Amkor's CBGAs are designed for low inductance,
improved thermal operation and enhanced
SMT-ability. Custom performance enhancements,
such as ground and power planes, are available
for significant improvements in electrical response
demanded by advancing electronics. Additionally,
these CBGAs utilize industry proven, semiconductor
grade materials for reliable, long-term operation
while providing the user flexible design parame-
ters. The CBGA is a ceramic substrate package. It
consist of a ceramic substrate which is covered
with a B-Staged epoxy lid or by encapsulating it.
Applications:
Semiconductor technologies find enhanced
performance by using the integrated design
features of Amkor's CBGAs. Microprocessors/con-
trollers, ASICs, Gate Arrays, memory, DSPs and PC
chip sets find Amkor's CBGA family to be an ideal
package. Applications requiring improved
portability, form-factor/size and high-performance
such as cellular, wireless, PCMCIA cards, laptop
PC's, video cameras, disc drives, power amplifiers
and other similar products benefit from Amkor's
CBGA attributes.
Features:
CBGA
The CBGA offers a variety of features. From
innovative designs and expanding package
offerings, Amkor provides a platform from
prototype-to-production.
• Flexible ball counts
• 10mm to 35mm body sizes
• 1.0, 1.27, 1.5mm ball pitch available
• Eutectic (63/37) solder balls
• Perimeter, stagger and full ball arrays
• Special packaging for memory available
• ≤ 6 mil coplanarity
• Multi-layer, ground/power
• Cavity lid seal or encapsulation
• Full in-house design capability
• JEDEC MO-151 standard outlines
• High thermal conductive ceramic
VISIT AMKOR TECHNOLOGY ONLINE FOR LOCATIONS AND
TO VIEW THE MOST CURRENT PRODUCT INFORMATION.
w w w. a m ko r. c o m
DS800
Rev Date: 08’02