CABGA Datasheet, PDF (1/2 Pages) Amkor Technology – ChipArray® Packages

data sheet
L A M I N AT E
ChipArray® Packages:
Amkor’s ChipArray® packages are laminate-
based Ball Grid Array (BGA) packages that are
compatible with established SMT mounting
processes. The near-chip-size standard outlines
offer a broad selection of ball array pitch, count,
and body sizes. (See table on back.) In addition
to the standard core ChipArray package (CABGA),
Amkor offers thin core ball grid array packages
(CTBGA and CVBGA) which, coupled with a thin
mold cap, achieve package thicknesses down to
1.0 mm max. By utilizing a thin core laminate,
much denser routing can be achieved, thereby
enabling more I/Os in a given footprint. Amkor
ChipArray packages, regardless of body size and
thickness, utilize the same, flexible capacity which
assures economical packaging solutions. Further,
high volume processes and innovative design
assure high quality and cutting edge technology.
Due to their small size and I/O density, Amkor’s
ChipArray product family is an excellent choice for
new devices requiring a small footprint size and
low mounted height.
Applications:
The ChipArray package family is applicable for
semiconductors such as memory, analog, ASICs,
RF devices and simple PLDs requiring a smaller
package size than conventional PBGAs.
ChipArray packages fill the need for low cost,
minimum space and high speed requirements
of mobile phones and pagers, notebook and
subnotebook personal computers, PDAs and
other wireless systems.
CABGA/CTBGA/CVBGA
Features:
Cutting edge technology and expanding
package offerings provide a platform from
prototype-to-production.
• Full, in-house design
• Square or rectangle packages available
• 4 mm to 21 mm body size available
• 8 to 449 ball counts
• 0.5, 0.65, 0.75, 0.80 & 1.0 mm ball pitch available
• JEDEC MO-216 compliant for 0.8 mm and
1.0 mm ball pitch
• JEDEC MO-195 compliant for 0.5 mm & 0.65 mm
ball pitch
• PB free and Green package available
• Daisy Chain packages available
• Short traces for excellent electrical inductance
• Low inductance (modeled data)
1.4nH (1.0 mm trace length)
4.1nH (5.0 mm trace length)
Thermal Resistance:
Theta JA at 1.0 Watt and 0 airflow (°C/Watt)
CABGA CTBGA CVBGA
8x8
10 x 10
11 x 11
15 x 15
19 x 19
37.28
19.86
29
20.1
17.04
36.45
29.04
N/A
N/A
N/A
37.52
26.7
N/A
N/A
N/A
Reliability:
Amkor assures reliable performance by
continuously monitoring key indices:
• Moisture sensitivity
characterization
• Temp/humidity
• High temp storage
• HAST
• Temp cycle
JEDEC Level 2 @ 240 °C
JEDEC Level 3 @ 260 °C
85 °C/85% RH, 168 hours
85 °C/85%, 1000 hours
150 °C, 1000 hours
130 °C/85% RH, 96 hours
-55/+125 °C, 1000 cycles
VISIT AMKOR TECHNOLOGY ONLINE FOR LOCATIONS AND
TO VIEW THE MOST CURRENT PRODUCT INFORMATION.
w w w. a m ko r. c o m
DS550N
Rev Date: 01’07