A64E06161_15 Datasheet, PDF (20/20 Pages) AMIC Technology – 1M X 16 Bit Low Voltage Super RAM

Package Information
48LD CSP (6 x 8 mm) Outline Dimensions
(48TFBGA)
TOP VIEW
Ball*A1 CORNER
123456
A
B
C
D
E
F
G
H
SIDE VIEW
A64E06161
unit: mm
BOTTOM VIEW
Ball#A1 CORNER
0.10 S C
0.25 S C A B
b (48X)
654321
A
B
C
D
E
F
G
H
B
e
D1
A
D
0.20(4X)
C _{SEATING PLANE}
Symbol
A
A1
D
E
D1
E1
e
b
Dimensions in mm
MIN. NOM. MAX.
---
--- 1.20
0.20 0.25 0.30
5.90 6.00 6.10
7.90 8.00 8.10
--- 3.75 ---
--- 5.25 ---
--- 0.75 ---
0.30 0.35 0.40
Note:
1. THE BALL DIAMETER, BALL PITCH, STAND-OFF & PACKAGE THICKNESS
ARE DIFFERENT FROM JEDEC SPEC MO192 (LOW PROFILE BGA FAMILY).
2. PRIMARY DATUM C AND SEATING PLANE ARE DEFINED BY THE SPHERICAL
CROWNS OF THE SOLDER BALLS.
3. DIMENSION b IS MEASURED AT THE MAXIMUM.
THERE SHALL BE A MINIMUM CLEARANCE OF 0.25mm BETWEEN THE EDGE OF
THE SOLDER BALL AND THE BODY EDGE.
4. BALL PAD OPENING OF SUBSTRATE IS Φ 0.3mm (SMD)
SUGGEST TO DESIGN THE PCB LAND SIZE AS Φ 0.3mm (NSMD)
(January, 2012, Version 1.2)
19
AMIC Technology, Corp.