X2P360 Datasheet, PDF(2/2 Page) AMI SEMICONDUCTOR

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X2P360 Datasheet, PDF (2/2 Pages) AMI SEMICONDUCTOR – 0.15μm Structured ASIC

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Product Description continued

schemes. I/Os support DCI on-chip termination. DDR

support for high-speed memory interface is built-in. High

fault coverage is provided through integrated scan-test,

memory BIST and JTAG support.

For FPGA conversions, rapid access to XPressArray (XPA)

technology can be achieved via AMI Semiconductor's

NETRANSÂ® FPGA-to-ASIC design flow. Alternatively, the

availability of XPA synthesis libraries for leading

commercial synthesizers allows conversion of FPGA

designs to ASICs by simply re-targeting from an FPGA

library to an XPA library.

For a data sheet with complete technical specifications,

please visit AMI Semiconductor's Technical Resources at

www.amis.com.

Technology

XPA-II technology is ideal for medium density ASIC

applications requiring high performance and low

power, with 1.5V operation. XPA-II devices are

fabricated using a hybrid technology that

integrates an established 0.15Âµm front-end

process with a proven AMIS metal finishing

technology, which is used to produce a

customized back-end. The 0.15Âµm processing

steps are common to multiple applications,

reducing costs by allowing existing tooling to be

utilized. At the same time, tooling and

manufacturing costs are significantly lower for the

metal finishing process than for traditional

0.15Âµm cell-based processes. The result is that

XPA-II delivers reduced cycle times and

significant reductions in terms of both NRE and

unit cost through manufacturing utilizing

structured ASIC technology.

There are nine bases in the AMIS XPA-II family.

These bases offer between 511K and 4.8M gates

and up to 4.8Mbits of block RAM. RAM may be

configured as single or dual port with

asymmetrical port widths. The architecture also

supports RAM initialization. Flexible I/O

technology includes fully configurable core and

I/O power supply pads and support for one of the

industry's widest ranges of I/O standards including

LVTTL, LVCMOS, PCI33, PCI66, PCI-X 133, PCI-X

2.0, GTL/+, HSTL class 1, 2, 3, and 4, SSTL2 class

1 and 2, LVPECL input, and LVDS. Comprehensive

clock management circuitry features up to eight

all digital DLLs and a maximum of eight PLLs.

Compared to equivalent FPGAs operating at the

same voltage levels, XPA-II devices offer higher

densities, better performance and lower power

consumption. Low power consumption further

contributes to cost savings as lower cost plastic

packaging can be used in many cases. XPA-II

products are designed for pin-for-pin replacement

of Xilinx and Altera FPGAs and offer integration of

multiple FPGAs into one ASIC. Package options

include a wide range of Flip Chip BGAs in 1.00mm

and 1.27mm pitches.

No Distributed RAM

50% Distributed RAM

XPA-II Base User I/Os DLLs PLLs 18K Memory Blocks Memory Bits (K)1 Logic Gates (K)2 Memory Bits (K)1 Logic Gates (K)2

X2P360

360

258

511

389

256

X2P560

560

X2P640

640

737

912

972

456

884

1219

1198

609

X2P720

720

X2P846

846

101

1056

1589

1459

725

1862

1854

2338

927

X2P880

880

101

1862

2127

2408

1063

X2P1040 1040 4 4

145

2673

2889

3414

1445

X2P1200 1200 8 8

189

3484

4085

4532

2042

X2P1360 1360 8 8

264

4866

4868

6116

2434

(1) Usable 2RW RAM bits

(2) Usable 2-NAND equivalent logic gates

AMI Semiconductor

www.amis.com

Devices sold by AMIS are covered by the warranty and patent indemnification provisions appearing in its Terms of Sale only. AMIS makes no warranty, express, statutory, implied

or by description, regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. AMIS makes no warranty of

merchantability or fitness for any purposes. AMIS reserves the right to discontinue production and change specifications and prices at any time and without notice. AMI

Semiconductor's products are intended for use in commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or high

reliability applications, such as military, medical life-support or life-sustaining equipment, are specifically not recommended without additional processing by AMIS for such