PI3034A Datasheet, PDF (2/7 Pages) AMI SEMICONDUCTOR – 200DPI CIS Sensor Chip

SYMBOL
SI
CLK
VDD
VSS
SIG
SO
FUNCTION
Start Pulse: Input to start the line scan.
Clock Pulse: Input to clock the Shift Register.
Positive Supply: +5 volt supply connected to substrate.
Digital Ground: Connection topside common.
Signal Current Output: Output for video signal current
End of Scan Pulse: Output from the shift register at end of scan.
Table 1. Pad Symbols and Functions
Bonding pad layout diagram:
Figure 2 shows the bonding pad locations for PI3034A Sensor Chip relative to the lower left corner
of the die.
7950 µm
Y
SI
SENSOR DIE
CLK
VDD GRD
SIG
290 µm
SO
X
X
NOTE: ALL PAD OPENINGS ARE 140 X 80 µm.
PAD
SI
CLK
VDD
VSS
SIG
SO
FUNCTION
START INPUT
CLOCK INPUT
+5 SUPPLY
GROUND
VIDEO SIGNAL OUT
SCAN OUTPUT
Y
67.5
67.5
67.5
67.5
67.5
67.5
X
737.0
1546.5
2356.0
3156.5
3975.0
7213.0
NOTES:
1. THE DRAWING IS NOT TO SCALE.
2. THE DIE LENGTH AND WIDTH
ARE GIVEN AS SHOWN.
3. THE PAD LOCATION ARE GIVEN
IN THE TABLE.
4. THERE ARE TWO EXAMPLES
OF THE X AND Y LOCATIONS
SHOWN ON THE FIRST TWO PADS.
THEY ARE MEASURED TO THE LEFT
BOTTOM CORNER OF THE PAD OPENING.
5. ALL DIMENSIONS ARE IN µm.
PI3034A IMAGE SENSOR
Figure 2. Bonding Pad Layout Diagram
Electro-Optical Characteristics (25 °C)
Table 2, below, lists the electro-optical characteristics of PI3034A sensor chip at 25 °C.
Parameters
Number of Photo-elements
Pixel-to-pixel spacing
Line scanning rate
Clock frequency
Video Output Voltage
Amplitude
Output voltage non-uniformity
Symbols
Tint ⁽¹⁾
f ⁽²⁾
Vp ⁽³⁾
Up ⁽⁴⁾
Typical
64
125
3.45
0.5
1.0
± 7.5
Units
elements
µm
ms/line
MHz
Volts
%
Notes
Vp depends the output
circuits. See note 3.
Page 2 of 7 - PI3034A, 06/15/03