PI240MC-A4 Datasheet, PDF (2/6 Pages) AMI SEMICONDUCTOR – 200DPI CIS Module

Illumination is by means of an integrated LED light source. All components are housed in a
small plastic housing which has a cover glass which acts as the focal point for the object
being scanned and
protects the imaging
array, micro lens
GLED
LED
LED
LED
LED
LED
LED
LED
LED
assembly, and LED light
source from dust. I/O to
the module is the 10-pin
connector located on one
end of the module. See
Figure 4. The
Mechanical Structure.
The cross section of the
VLED
12
ROD LENS
PHOTO SENSORS
1726
1728
1727
3 4 5 ----------------
SHIFT REGISTER
VIDEO
LINE
VN(-V)
VDD (+5)
GRD
PI240MC-A4 is shown in
BUFFER
VIDEO AMPLIFIER
VOUT
Figure 1 and the block
diagram in Figure 2.
CP
SP
GRD
Figure 2. PI240MC-A4 Module Block Diagram
Recommended Operating Conditions (25 °C)
Item
Power Supply
Video Output Level
Input voltage at digital high
Input voltage at digital low
Clock frequency
Clock pulse high duty cycle
Clock pulse high duration
Integration time
Operating temperature
Symbol
Vdd
Idd
Vn
Ivn
VLED
ILED
Vid
Vih
Vil
F
Tint⁽¹⁾
Top
Min
Typical Max
4.5
5.0
5.5
24
30
35
-4.5
-5
-15
5
6
8
4.5
5.0
5.5
305
430
560
0.8
1.0
1.2
Vdd -1.0 Vdd -0.5 Vdd
0
0.8
3.0
5.0
25
50
0.346
0.6
10.0
25
50
Units
V
ma
V
ma
V
ma
V
V
V
MHz
%
ns
ms
0_C
Note (1). Tint is determined by time interval between two start pulses, SP. The longest
integration time is determined by the degree of leakage current degradation that can be
tolerated by the system. A 10ms maximum is a typical rule-of-thumb hence the experienced
CIS user can use his discretion in determining the integration time.
PAGE 2 OF 6 - PI240MC-A4, 4/5/01