AME1300 Datasheet, PDF (11/12 Pages) Analog Microelectronics – 300mA CMOS LDO with RESET Function

AME
AME1300
300mA CMOS LDO with
RESET Function
n Package Dimension
MSOP-8
Top View
D
e1
E1
E
PIN 1 I.D
(SHINNY SURFACE)
A A2
A1
Front View
e
b
End View
B
B
E1
See Detail A
DETAIL A
TOP PKG.
BTM PKG.
L2
L
L1
R0.127(0 .005) TYP
ALL CORNER
& EDGES
SECTION B-B
b
b1
BASE METAL
c
c1
WITH PLATING
SYMBOLS
A
A₁
A2
b
b1
c
c1
D
E
E1
e
e1
L
L1
L2
θ
MILLIMETERS
MIN MAX
-
1.07
0.05
0.20
0.81
0.92
0.28
0.38
0.28
0.33
0.13
0.23
0.13
0.17
2.90
3.10
4.77
4.98
2.90
3.10
0.65 TYP
1.95 TYP
0.406 0.686
0.94 REF
0.254 TYP
0^o
8^o
INCHES
MIN MAX
- 0.04197
0.002 0.008
0.032 0.036
0.011 0.015
0.011 0.013
0.005 0.009
0.005 0.006
0.114
0.188
0.122
0.196
0.114 0.122
0.0255 TYP
0.0767 TYP
0.01598 0.02701
0.037 REF
0.010 TYP
0^o
8^o
NOTE:
1. Controlling dimension : Millimeter, converted inchdimension
are not necessarily exact.
2. Dimensiioning and tolerancing per ansi Y14.5m-1994.
3. Dimension "d" does not include mold flash,protrusion or gate
burr, mold flash,protrusion and gate burr shall not exceed
0.15mm(0.006") per side. Dimension e1 do not include inter-lead
flash or protrusion, inter-lead flash and protrusion shall not ex-
ceed 0.15mm(0.006") per side.
4. The package top be smaller than the package bottom. Dimen-
sion d and e1 are determined at outermost extremes of the
plastic body exclusive of mold flash, tie bar burrs, gate burrs
and interlead flash, but including any mismatch between the top
and bottom of the plastic body.
5. Dimension 'b' does not include dambar protrusion. Allowable
dambar protrusion shall be 0.08mm(0.0031) total in excess of
the "b" dimension at maximum material condition.
Rev.C.02
11