AME8850 Datasheet, PDF (6/19 Pages) Analog Microelectronics – 600mA CMOS LDO

AME, Inc.
AME8850
600mA CMOS LDO
n Thermal Information
Parameter
Package
Die Attach Symbol Maximum
SOP-8
60
Thermal Resistance*
(Junction to Case)
SOT-25 / TSOT-25
DFN-8
E P S ^(3mm1^x1^3mmx0.75mm)
SOP-8
θJC
81
17
150
Thermal Resistance
Conductive
(Junction to Ambient)
SOT-25 / TSOT-25
Epoxy
θJA
260
DFN-8
125
(3mmx3mmx0.75mm)
SOP-8
810
Internal Power Dissipation
Solder Iron (10 Sec)**
SOT-25 / TSOT-25
DFN-8
(3mmx3mmx0.75mm)
P_D
400
800
350
* Measure θ_JC on center of molding compound if IC has no tab. O
** MIL-STD-202G 210F F
Unit
o_{C / W}
mW
o_C
6
Rev.B.01