AME8502 Datasheet, PDF (6/20 Pages) Analog Microelectronics – Portable Electronics

AME
AME8502
n Thermal Information
µProcessor Supervisory
Parameter
Package
Die Attach
Symbol Maximum Unit
SOT-23
TSOT-23A
Conductive Epoxy
81
SOT-143
130
Thermal Resistance*
(Junction to Case)
SOT-23
SOT-25
θ_JC
140
o_{C / W}
TSOT-23A Non-Conductive Epoxy
TSOT-25A
130
SC-70-4
120
SOT-23
260
TSOT-23A Conductive Epoxy
230
Thermal Resistance
(Junction to Ambient)
SOT-143
SOT-23
SOT-25
350
θ_JA
280
o_{C / W}
TSTO-23A Non-Conductive Epoxy
TSOT-25A
250
SC-70-4
400
SOT-23
400
TSOT-23A Conductive Epoxy
455
SOT-143
285
Internal Power Dissipation
SOT-23
SOT-25
P_D
400
mW
TSTO-23A Non-Conductive Epoxy
TSOT-25A
400
SC-70-4
Lead Temperature ( soldering 10 sec)**
300
260
o_C
* Measure θ_JC on center of molding compound if IC has no tab.
** MIL-STD-202G 210F.
6
Rev. A.01