AME41-ADJ_1 Datasheet, PDF (6/12 Pages) Analog Microelectronics – Shunt Bandgap Voltage Reference

AME
AME41-ADJ
Shunt Bandgap Voltage Reference
n Thermal Information
Parameter
Package Die Attach Symbol Maximum
Unit
Thermal Resistance*
(Junction to Case)
SOT-23
Non-Conductive
Epoxy
TO-92-3
θ_JC
SOP-8
Conductive
Epoxy
Thermal Resistance
(Junction to Ambient)
SOT-23
Non-Conductive
Epoxy
TO-92-3
θ_JA
SOP-8
Conductive
Epoxy
Internal Power Dissipation
SOT-23
Non-Conductive
Epoxy
TO-92-3
P_D
SOP-8
Conductive
Epoxy
Maximum Junction Temperature
Solder Iron (10 Sec)**
140
80
o_{C / W}
60
280
150
o_{C / W}
150
400
625
mW
810
150
o_C
350
o_C
* Measure θ_JC on center of molding compound if IC has no tab.
** MIL-STD-202G 210F
n Electrical Specifications
Unless otherwise specified, T_A = 25^OC, I = 100µA
Parameter
Reference Voltage, ±0.5%
Minimum Current
Reference Voltage Change
With Current
ADJ Pin Current
Reference Voltage Temp.
Coeff.
Symbol
V_REF
I_MIN
dV_REF/I
I_ADJ
V_REFTC
Test Condition
T_A = 25^oC, I_REF = 100µA
I_MIN < I < 1mA
1mA < I < 20mA
0^oC < T_A < 70^oC
Min Typ Max
1.244 1.250 1.256
30
1.5 3
4
8
20
Units
V
µA
mV
nA
100 ppm/^oC
6
Rev.G.03