AME41-1.2 Datasheet, PDF (6/14 Pages) Analog Microelectronics – Shunt Bandgap Voltage Reference

AME
AME41-1.2
Shunt Bandgap Voltage Reference
n Thermal Information
Parameter
Package Die Attach Symbol Maximum
Unit
Thermal Resistance*
(Junction to Case)
SOT-23
Non-Conductive
TO-92-2
TO-92-3
Epoxy
θ_JC
SOP-8
Conductive
Epoxy
140
80
o_{C / W}
60
Thermal Resistance
(Junction to Ambient)
SOT-23
Non-Conductive
TO-92-2
TO-92-3
Epoxy
θ_JA
SOP-8
Conductive
Epoxy
280
150
o_{C / W}
150
Internal Power Dissipation
SOT-23
Non-Conductive
TO-92-2
TO-92-3
Epoxy
P_D
SOP-8
Conductive
Epoxy
Maximum Junction Temperature
Solder Iron (10 Sec)**
* Measure θ_JC on center of molding compound if IC has no tab.
** MIL-STD-202G 210F
400
625
mW
810
150
o_C
350
o_C
n Electrical Specifications
Unless otherwise specified, T_A = 25⁰C, I=100µA
Parameter
Reference Voltage, ±0.5%
Minimum Current
Reference Voltage Change
With Current
Reference Voltage Temp.
Coeff.
Symbol
V_REF
I_MIN
dVREF/I
V_REFTC
Test Condition
T_A = 25^oC, I_REF = 100µA
I_MIN < I < 1mA
1mA < I < 20mA
0^oC < T_A < 70^oC
Min Typ Max
1.244 1.250 1.256
30
1.5
3
4
8
Units
V
µA
mV
100 ppm/^oC
6
Rev.G.03