AME385-2.5_1 Datasheet, PDF (6/14 Pages) Analog Microelectronics – Shunt Bandgap Voltage Reference

AME
AME385-2.5
Shunt Bandgap Voltage Reference
n Thermal Information
Parameter
Package Die Attach Symbol Maximum
Thermal Resistance*
(Junction to Case)
SOT-23
140
Non-Conductive
TO-92-2
TO-92-3
Epoxy
θ_JC
80
SOP-8
Conductive
60
Epoxy
SOT-23
280
Non-Conductive
Thermal Resistance
(Junction to Ambient)
TO-92-2
TO-92-3
Epoxy
θ_JA
150
SOP-8
Conductive
Epoxy
150
SOT-23
400
Non-Conductive
Internal Power Dissipation
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625
SOP-8
Conductive
810
Epoxy
Maximum Junction Temperature
150
Solder Iron (10 Sec)**
350
* Measure θ_JC on center of molding compound if IC has no tab. O
** MIL-STD-202G 210F F
Unit
o_{C / W}
o_{C / W}
mW
o_C
o_C
6
Rev.G.03