AME385-1.2 Datasheet, PDF (6/14 Pages) Analog Microelectronics – Shunt Bandgap Voltage Reference

AME
AME385-1.2
Shunt Bandgap Voltage Reference
n Thermal Information
Parameter
Package Die Attach Symbol Maximum Unit
Thermal Resistance*
(Junction to Case)
SOT-23
Non-Conductive
TO-92-2
TO-92-3
Epoxy
θ_JC
SOP-8
Conductive
Epoxy
Thermal Resistance
(Junction to Ambient)
SOT-23
Non-Conductive
TO-92-2
TO-92-3
Epoxy
θ_JA
SOP-8
Conductive
Epoxy
Internal Power Dissipation
SOT-23
Non-Conductive
TO-92-2
TO-92-3
Epoxy
P_D
SOP-8
Conductive
Epoxy
Maximum Junction Temperature
Solder Iron (10 Sec)**
140
80
o_{C / W}
60
280
150
o_{C / W}
150
400
625
mW
810
150
o_C
350
o_C
* Measure θ_JC on center of molding compound if IC has no tab.
** MIL-STD-202G 210F
6
Rev.G.03