AME8833AEIV300 Datasheet, PDF (12/14 Pages) Analog Microelectronics – High PSRR, 150mA CMOS LDO

AME, Inc.
AME8833/8834
n Package Dimension
SC-70
Top View
D
e1
C ^0.15(0.006)
D
Side View
AA
E1/2
E1
C ^0.15(0.006)
e
.10(0.004) M _{C A B}
E/2
E
B
See Detail A
b
Front View
C .10(0.004)
A2 A
SEATING PLANE
A1
C
Detail A
£ c1
H .15(.0059)
GAGE
PLANE
L
SECTION A-A
(b)
b1
c1 c
BASE METAL
£c
High PSRR, 150mA CMOS LDO
SYMBOLS
A
A1
A2
b
b1
c
c1
D
E
E1
e
e1
L
è1
è2
MILLIMETERS
MIN MAX
0.80
1.10
0.00
0.10
0.80
1.00
0.15
0.30
0.15
0.25
0.08
0.25
0.08
0.20
1.90
2.15
2.00
2.20
1.15
1.35
0.65BSC
1.30BSC
0.26
0^o
4^o
0.46
8^o
10^o
INCHES
MIN MAX
0.031 0.043
0.000
0.031
0.006
0.006
0.004
0.040
0.012
0.010
0.003 0.010
0.003 0.008
0.074 0.084
0.078 0.086
0.045 0.055
0.0255BSC
0.0512BSC
0.010
0^o
4^o
0.018
8^o
10^o
NOTE:
1. Controlling Dimension : Millimeter, converted inch dimension
are not necessarily exact.
2. Dimensiioning and tolerancing per ansi Y14.5m-1994.
3. Dimension "d" does not include mold flash,protrusion or gate
burr, mold flash,protrusion or gate burr shall not exceed
0.15mm(0.006") per end. Dimension E1 do not include inter-lead
flash or protrusion, inter-lead flash or protrusion shall not ex-
ceed 0.15mm(0.006") per side.
4. The package top be smaller than the package bottom. Dimen-
sion D and E1 are determined at outermost extremes of the
plastic body exclusive of mold flash, tie bar burrs, gate burrs
and interlead flash, but including any mismatch between the top
and bottom of the plastic body.
12