AME8808_08 Datasheet, PDF (12/13 Pages) Analog Microelectronics – 750mA CMOS LDO

AME
AME8808
n Package Dimension
TO-252-2(DPAK)-EIAJ
Top View
E
K
L
Side View
B
A
F
G
C
J
H
D
750mA CMOS LDO
MILLIMETERS
SYMBOLS
MIN MAX
INCHES
MIN MAX
A
0.43
0.58 0.0169 0.0230
B
1.60
1.95 0.0630 0.0768
C
0.51
1.78 0.0200 0.0701
D
0.43
0.60 0.0169 0.0236
E
6.35
6.80 0.2500 0.2677
F
5.36
7.20 0.2110 0.2835
G
2.20
3.00 0.0866 0.1181
H
-
* 2.30
-
*0.0906
J
-
0.97
-
0.0380
K
5.20
5.50 0.2047 0.2165
L
1.40REF
0.055REF
*: Typical Value
Notes:
1. Controlling dimension: Millimeters.
2. Maximum lead thickness includes lead finish thickness Mini-
mum lead thickness is the minimum thickness of base material.
SOT-223
Top View
D
B1
H
E
Side View
C
13^o(4X)
e
Front View
13^o(4X)
F
A1
B
SYMBOLS
A₁
B
B₁
C
D
E
F
e
H
θ
MILLIMETERS
MIN MAX
0.01
0.10
0.60
0.84
2.90
3.15
0.24
0.38
6.30
6.71
3.30
3.71
1.40
1.80
2.30 BSC
6.70
0^o
7.30
10^o
INCHES
MIN MAX
0.0004 0.0039
0.0236 0.0330
0.1140 0.1240
0.0094 0.0150
0.2480 0.2640
0.1299 0.1460
0.0551 0.0709
0.0906 BSC
0.2638 0.2874
0^o
10^o
12
Rev.G.02