AM29F010B Datasheet, PDF (6/14 Pages) SPANSION – 1 Megabit (128 K x 8-bit) CMOS 5.0 Volt-only, Uniform Sector Flash Memory

PAD DESCRIPTION
SUPPLEMENT
Pad
Signal
Pad Center (mils)
X
Y
Pad Center (millimeters)
X
Y
1
V_CC
0.00
0.00
0.00
0.00
2
A16
–6.78
0.00
–0.17
0.00
3
A15
–12.20
0.00
–0.31
0.00
4
A12
–18.03
0.00
–0.46
0.00
5
A7
–23.46
0.00
–0.60
0.00
6
A6
–29.29
0.00
–0.74
0.00
7
A5
–34.72
0.00
–0.88
0.00
8
A4
–41.75
–5.01
–1.06
–0.13
9
A3
–41.14
–116.93
–1.04
–2.97
10
A2
–41.30
–134.13
–1.05
–3.41
11
A1
–35.88
–134.13
–0.91
–3.41
12
A0
–30.04
–134.13
–0.76
–3.41
13
D0
–23.81
–133.31
–0.60
–3.39
14
D1
–17.89
–133.31
–0.45
–3.39
15
D2
–12.06
–133.31
–0.31
–3.39
16
V_SS
–6.40
–133.31
–0.16
–3.39
17
D3
–0.59
–133.31
–0.01
–3.39
18
D4
5.25
–133.31
0.13
–3.39
19
D5
11.16
–133.31
0.28
–3.39
20
D6
17.00
–133.31
0.43
–3.39
21
D7
22.92
–133.31
0.58
–3.39
22
CE#
29.09
–134.37
0.74
–3.41
23
A10
35.02
–134.13
0.89
–3.41
24
OE#
34.68
–116.93
0.88
–2.97
25
A11
35.45
–5.01
0.90
–0.13
26
A9
29.27
–0.25
0.74
–0.01
27
A8
23.34
0.00
0.59
0.00
28
A13
17.92
0.00
0.46
0.00
29
A14
12.08
0.00
0.31
0.00
30
WE#
6.66
0.00
0.17
0.00
Note: The coordinates above are relative to the center of pad 1 and can be used to operate wire bonding equipment.
4
Am29F010B Known Good Die