AM29LV200B_03 Datasheet, PDF (5/11 Pages) Advanced Micro Devices – 2 Megabit (256 K x 8-Bit/128 K x 16-Bit) CMOS 3.0 Volt-only, Boot Sector Flash Memory, Die Revison 1

SUPPLEMENT
PAD DESCRIPTION (RELATIVE TO V_CC)
Pad Center (mils)
Pad
Signal
X
Y
1
V_CC
0.00
0.00
2
DQ4
–12.10
0.00
3
DQ12
–18.00
0.00
4
DQ5
–23.90
0.00
5
DQ13
–29.80
0.00
6
DQ6
–35.60
0.00
7
DQ14
–41.50
0.00
8
DQ7
–47.40
0.00
9
DQ15/A–1
–53.30
0.00
10
V_SS
–62.70
–1.50
11
BYTE#
–62.70
–11.60
12
A16
–62.70
–21.70
13
A15
–62.40
–112.50
14
A14
–55.00
–112.50
15
A13
–49.60
–112.50
16
A12
–43.80
–112.50
17
A11
–38.40
–112.50
18
A10
–32.50
–112.50
19
A9
–27.10
–112.30
20
A8
–21.20
–112.50
21
WE#
–15.70
–112.50
22
RESET#
–6.20
–116.30
23
RY/BY#
11.10
–116.30
24
Not Connected
N/A
N/A
25
A7
28.90
–112.50
26
A6
34.30
–112.50
27
A5
40.20
–112.50
28
A4
45.60
–112.50
29
A3
51.40
–112.50
30
A2
56.80
–112.50
31
A1
64.20
–112.50
32
A0
64.50
–21.90
33
CE#
64.50
–11.80
34
V_SS
64.50
–1.70
35
OE#
55.10
0.90
36
DQ0
47.50
0.00
37
DQ8
41.60
0.00
38
DQ1
35.80
0.00
39
DQ9
29.80
0.00
40
DQ2
24.00
0.00
41
DQ10
18.10
0.00
42
DQ3
12.30
0.00
43
DQ11
6.30
0.00
Pad Center (millimeters)
X
Y
0.00
0.00
–0.31
0.00
–0.46
0.00
–0.61
0.00
–0.76
0.00
–0.90
0.00
–1.05
0.00
–1.20
0.00
–1.35
0.00
–1.59
–0.04
–1.59
–0.29
–1.59
–0.55
–1.58
–2.86
–1.40
–2.86
–1.26
–2.86
–1.11
–2.86
–0.98
–2.86
–0.83
–2.86
–0.69
–2.85
–0.54
–2.86
–0.40
–2.86
–0.16
–2.95
0.28
–2.95
N/A
N/A
0.73
–2.86
0.87
–2.86
1.02
–2.86
1.16
–2.86
1.31
–2.86
1.44
–2.86
1.63
–2.86
1.64
–0.56
1.64
–0.30
1.64
–0.04
1.40
0.02
1.21
0.00
1.06
0.00
0.91
0.00
0.76
0.00
0.61
0.00
0.46
0.00
0.31
0.00
0.16
0.00
Note: The coordinates above are relative to the center of pad 1 and can be used to operate wire bonding equipment.
November 18, 2003
Am29LV200B Known Good Die
5