AM29DS323D_06 Datasheet, PDF (5/56 Pages) Advanced Micro Devices – 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 1.8 Volt-only, Simultaneous Operation Flash Memory

DATA SHEET
TABLE OF CONTENTS
Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 4
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . . 5
Special Handling Instructions for FBGA Package .................... 6
Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 8
Device Bus Operations . . . . . . . . . . . . . . . . . . . . . . 9
Table 1. Am29DS323D Device Bus Operations ...............................9
Word/Byte Configuration .......................................................... 9
Requirements for Reading Array Data ..................................... 9
Writing Commands/Command Sequences ............................ 10
Accelerated Program Operation ......................................................10
Autoselect Functions .......................................................................10
Simultaneous Read/Write Operations with Zero Latency ....... 10
Standby Mode ........................................................................ 10
Automatic Sleep Mode ........................................................... 10
RESET#: Hardware Reset Pin ............................................... 11
Output Disable Mode .............................................................. 11
Table 2. Am29DS323D Device Bank Divisions ...............................11
Table 3. Top Boot Sector Addresses (Am29DS32xDT) ..................12
Table 4. Secured Silicon Sector Addresses for Top Boot Devices . 13
Table 5. Bottom Boot Sector Addresses (Am29DS32xDB) ............14
Table 6. Secured Silicon Sector Addresses for Bottom Boot Devices
15
Autoselect Mode ..................................................................... 16
Table 7. Am29DS323D Autoselect Codes (High Voltage Method) 16
Sector/Sector Block Protection and Unprotection .................. 17
Table 8. Top Boot Sector/Sector Block Addresses
for Protection/Unprotection .............................................................17
Table 9. Bottom Boot Sector/Sector Block
Addresses for Protection/Unprotection ...........................................17
Write Protect (WP#) ................................................................ 18
Temporary Sector/Sector Block Unprotect ............................. 18
Figure 1. Temporary Sector Unprotect Operation........................... 18
Figure 2. In-System Sector/Sector Block Protect
and Unprotect Algorithms................................................................ 19
Secured Silicon Sector Flash Memory Region ....................... 20
Hardware Data Protection ...................................................... 20
Low VCC Write Inhibit .....................................................................21
Write Pulse “Glitch” Protection ........................................................21
Logical Inhibit ..................................................................................21
Power-Up Write Inhibit ....................................................................21
Common Flash Memory Interface (CFI) . . . . . . . 21
Table 10. CFI Query Identification String ........................................ 21
Table 11. System Interface String................................................... 22
Table 12. Device Geometry Definition ............................................ 22
Table 13. Primary Vendor-Specific Extended Query ...................... 23
Command Definitions . . . . . . . . . . . . . . . . . . . . . . 24
Reading Array Data ................................................................ 24
Reset Command ..................................................................... 24
Autoselect Command Sequence ............................................ 24
Enter Secured Silicon Sector/Exit Secured Silicon Sector
Command Sequence .............................................................. 25
Byte/Word Program Command Sequence ............................. 25
Unlock Bypass Command Sequence ..............................................25
Figure 3. Program Operation .......................................................... 26
Chip Erase Command Sequence ........................................... 26
Sector Erase Command Sequence ........................................ 26
Erase Suspend/Erase Resume Commands ........................... 27
Figure 4. Erase Operation.............................................................. 27
Command Definitions ............................................................. 28
Table 14. Am29DS323D Command Definitions.............................. 28
Write Operation Status . . . . . . . . . . . . . . . . . . . . 29
DQ7: Data# Polling ................................................................. 29
Figure 5. Data# Polling Algorithm .................................................. 29
RY/BY#: Ready/Busy# ............................................................ 30
DQ6: Toggle Bit I .................................................................... 30
Figure 6. Toggle Bit Algorithm........................................................ 30
DQ2: Toggle Bit II ................................................................... 31
Reading Toggle Bits DQ6/DQ2 ............................................... 31
DQ5: Exceeded Timing Limits ................................................ 31
DQ3: Sector Erase Timer ....................................................... 31
Table 15. Write Operation Status ................................................... 32
Absolute Maximum Ratings . . . . . . . . . . . . . . . . 33
Figure 7. Maximum Negative Overshoot Waveform ..................... 33
Figure 8. Maximum Positive Overshoot Waveform....................... 33
Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . . 33
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 34
Figure 9. I_CC1 Current vs. Time (Showing Active and
Automatic Sleep Currents) ............................................................. 35
Figure 10. Typical I_CC1 vs. Frequency ............................................ 35
Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Figure 11. Test Setup.................................................................... 36
Table 16. Test Specifications ......................................................... 36
Figure 12. Input Waveforms and Measurement Levels ................. 36
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 37
Figure 13. Read Operation Timings ............................................... 37
Figure 14. Reset Timings ............................................................... 38
Word/Byte Configuration (BYTE#) .......................................... 39
Figure 15. BYTE# Timings for Read Operations............................ 39
Figure 16. BYTE# Timings for Write Operations............................ 39
Erase and Program Operations .............................................. 40
Figure 17. Program Operation Timings.......................................... 41
Figure 18. Accelerated Program Timing Diagram.......................... 41
Figure 19. Chip/Sector Erase Operation Timings .......................... 42
Figure 20. Back-to-back Read/Write Cycle Timings ...................... 43
Figure 21. Data# Polling Timings (During Embedded Algorithms). 44
Figure 22. Toggle Bit Timings (During Embedded Algorithms)...... 45
Figure 23. DQ2 vs. DQ6................................................................. 45
Figure 24. Temporary Sector/Sector Block
Unprotect Timing Diagram ............................................................. 46
Figure 25. Sector/Sector Block Protect/Unprotect Timing Diagram 47
Figure 26. Alternate CE# Controlled Write
(Erase/Program) Operation Timings .............................................. 49
Erase And Programming Performance . . . . . . . 50
Latchup Characteristics . . . . . . . . . . . . . . . . . . . . 50
Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
FBD048—48-ball Fine-Pitch Ball Grid Array (FBGA)
6 x 12 mm package ................................................................ 51
TS 048—48-Pin Standard TSOP ............................................ 52
Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 53
October 10, 2006 23480A5
Am29DS323D
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