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DS42546 Datasheet, PDF (40/57 Pages) Advanced Micro Devices – Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AC CHARACTERISTICS
Flash Erase and Program Operations
Parameter
JEDEC
Std Description
tAVAV
tAVWL
tWC Write Cycle Time (Note 1)
tAS Address Setup Time (WE# to Address)
tASO
Address Setup Time to OE# or CE#f low during toggle bit
polling
tWLAX
tAH Address Hold Time (WE# to Address)
tAHT
Address Hold Time From CE#f or OE# high during toggle bit
polling
tDVWH
tWHDX
tDS Data Setup Time
tDH Data Hold Time
tOEH OE# Hold Time
Read
Toggle and Data# Polling
tGHEL
tGHWL
tWLEL
tELWL
tEHWH
tWHEH
tWLWH
tELEH
tWHDL
tWHWH1
tOEPH
tGHEL
tGHWL
tWS
tCS
tWH
tCH
tWP
tCP
tWPH
tSR/W
tWHWH1
Output Enable High during toggle bit polling
Read Recovery Time Before Write (OE# High to CE#f Low)
Read Recovery Time Before Write (OE# High to WE# Low)
WE# Setup Time (CE#f to WE#)
CE#f Setup Time (WE# to CE#f)
WE# Hold Time (CE#f to WE#)
CE#f Hold Time (CE#f to WE#)
Write Pulse Width
CE#f Pulse Width
Write Pulse Width High
Latency Between Read and Write Operations
Programming Operation (Note 2)
Byte
Word
tWHWH1
tWHWH1
Accelerated Programming Operation,
Word or Byte (Note 2)
tWHWH2
tWHWH2 Sector Erase Operation (Note 2)
tVCS VCCf Setup Time (Note 1)
tRB Write Recovery Time from RY/BY#
tBUSY Program/Erase Valid to RY/BY# Delay
Notes:
1. Not 100% tested.
2. See the “Flash Erase And Programming Performance” section for more information.
85 ns Speed
Min
Typ
Max
85
0
15
45
0
35
0
0
10
20
20
20
0
0
0
0
0
0
35
35
30
0
5
7
4
0.7
50
0
90
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
µs
µs
sec
µs
ns
ns
40
DS42546