|
AM42DL32X4G Datasheet, PDF (1/64 Pages) Advanced Micro Devices – 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory and 4 Mbit (256 K x 16-Bit) Static RAM | |||
|
PRELIMINARY
Am42DL32x4G
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash
Memory and 4 Mbit (256 K x 16-Bit) Static RAM
DISTINCTIVE CHARACTERISTICS
MCP Features
â Power supply voltage of 2.7 to 3.3 volt
â High performance
â Flash Access time as fast as 70 ns
â SRAM access time as fast as 55 ns
â Package
â 73-Ball FBGA
â Operating Temperature
â â40°C to +85°C
Flash Memory Features
ARCHITECTURAL ADVANTAGES
â Simultaneous Read/Write operations
â Data can be continuously read from one bank while
executing erase/program functions in other bank
â Zero latency between read and write operations
â Secured Silicon (SecSi) Sector: Extra 256 Byte sector
â Factory locked and identifiable: 16 bytes available for
secure, random factory Electronic Serial Number; verifiable
as factory locked through autoselect function.
â Customer lockable: Sector is one-time programmable. Once
locked, data cannot be changed
â Zero Power Operation
â Sophisticated power management circuits reduce power
consumed during inactive periods to nearly zero
â Top or bottom boot block
â Manufactured on 0.17 µm process technology
â Compatible with JEDEC standards
â Pinout and software compatible with single-power-supply
flash standard
PERFORMANCE CHARACTERISTICS
â High performance
â Access time as fast as 70 ns
â Program time: 4 µs/word typical utilizing Accelerate function
â Ultra low power consumption (typical values)
â 2 mA active read current at 1 MHz
â 10 mA active read current at 5 MHz
â 200 nA in standby or automatic sleep mode
â Minimum 1 million write cycles guaranteed per sector
â 20 Year data retention at 125°C
â Reliable operation for the life of the system
SOFTWARE FEATURES
â Data Management Software (DMS)
â AMD-supplied software manages data programming and
erasing, enabling EEPROM emulation
â Eases sector erase limitations
â Supports Common Flash Memory Interface (CFI)
â Erase Suspend/Erase Resume
â Suspends erase operations to allow programming in same
bank
â Data# Polling and Toggle Bits
â Provides a software method of detecting the status of
program or erase cycles
â Unlock Bypass Program command
â Reduces overall programming time when issuing multiple
program command sequences
HARDWARE FEATURES
â Any combination of sectors can be erased
â Ready/Busy# output (RY/BY#)
â Hardware method for detecting program or erase cycle
completion
â Hardware reset pin (RESET#)
â Hardware method of resetting the internal state machine to
reading array data
â WP#/ACC input pin
â Write protect (WP#) function allows protection of two outermost
boot sectors, regardless of sector protect status
â Acceleration (ACC) function accelerates program timing
â Sector protection
â Hardware method of locking a sector, either in-system or
using programming equipment, to prevent any program or
erase operation within that sector
â Temporary Sector Unprotect allows changing data in
protected sectors in-system
SRAM Features
â Power dissipation
â Operating: 22 mA maximum for 70 ns, 30 mA maximum for
55 ns
â Standby: 10 µA maximum
â CE1s# and CE2s Chip Select
â Power down features using CE1s# and CE2s
â Data retention supply voltage: 1.5 to 3.3 volt
â Byte data control: LB#s (DQ7âDQ0), UB#s (DQ15âDQ8)
This document contains information on a product under development at Advanced Micro Devices. The information
Publication# 25822 Rev: B Amendment/0
is intended to help you evaluate this product. AMD reserves the right to change or discontinue work on this proposed
Issue Date: May 19, 2003
product without notice.
Refer to AMDâs Website (www.amd.com) for the latest information.
|
▷ |