EP4CE115F23C8N Datasheet, PDF (5/14 Pages) Altera Corporation – Cyclone IV FPGA Device Faily Overview

Package Matrix
Table 1–3 lists Cyclone IV E device package offerings.
Table 1–3. Package Offerings for the Cyclone IV E Device Family ^{(1), (2)}
Package
E144
M164
M256
U256
Size (mm)
22 × 22
8×8
9x9
14 × 14
Pitch (mm)
0.5
0.5
0.5
0.8
F256
17 × 17
1.0
F324
19 x 19
1.0
U484
19 × 19
0.8
F484
23 × 23
1.0
F780
29 × 29
1.0
Device
EP4CE6
91 21 — — — — 179 66 179 66 — — — — — — — —
EP4CE10 91 21 — — — — 179 66 179 66 — — — — — — — —
EP4CE15 81 18 89 21 165 53 165 53 165 53 — — — — 343 137 — —
EP4CE22 79 17 — — — — 153 52 153 52 — — — — — — — —
EP4CE30 — — — — — — — — — — 193 68 — — 328 124 532 224
EP4CE40 — — — — — — — — — — 193 68 328 124 328 124 532 224
EP4CE55 — — — — — — — — — — — — 324 132 324 132 374 160
EP4CE75 — — — — — — — — — — — — 292 110 292 110 426 178
EP4CE115 — — — — — — — — — — — — — — 280 103 528 230
Notes to Table 1–3:
(1) The E144 package has an exposed pad at the bottom of the package. This exposed pad is a ground pad that must be connected to the ground plane of your PCB. Use this exposed pad for electrical
connectivity and not for thermal purposes.
(2) Use the Pin Migration View window in Pin Planner of the Quartus II software to verify the pin migration compatibility when you perform device migration. For more information, refer to the I/O
Management chapter in volume 2 of the Quartus II Handbook.
(3) This includes both dedicated and emulated LVDS pairs. For more information, refer to the I/O Features in Cyclone IV Devices chapter.