EP1K30TC144-1N Datasheet, PDF (111/182 Pages) Altera Corporation – Package Information Datasheet for Mature Altera Devices

Package Information Datasheet for Mature Altera Devices
111
484-Pin FineLine Ball-Grid Array (FBGA), Option 4—Flip Chip
■ All dimensions and tolerances conform to ASME Y14.5M – 1994.
■ Controlling dimension is in millimeters.
■ Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on
package surface.
Package Information
Description
Ordering Code Reference
Package Acronym
Substrate Material
Solder Ball Composition
JEDEC Outline Reference
Lead Coplanarity
Weight
Moisture Sensitivity Level
Specification
F
FBGA
BT
Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
MS-034 Variation: AAJ-1
0.008 inches (0.20 mm)
5.3 g (Typ.)
Printed on moisture barrier bag
Package Outline Dimension Table
Symbol
Min.
A
—
A1
0.30
A2
0.25
A3
—
D
D1
E
E1
b
0.50
e
Millimeters
Nom.
—
—
—
—
23.00 BSC
17.00 BSC
23.00 BSC
17.00 BSC
0.60
1.00 BSC
Max.
3.50
—
3.00
2.50
0.70
© December 2011 Altera Corporation
Package Information Datasheet for Mature Altera Devices